Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC /
"The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book presents a...
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| Language: | eng |
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Hoboken, N.J. : Wiley-IEEE Press,
c201
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| _version_ | 1826450641351868416 |
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| author | 529862 Li, Er-Ping |
| author_facet | 529862 Li, Er-Ping |
| author_sort | 529862 Li, Er-Ping |
| collection | OCEAN |
| description | "The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book presents a number of special methods to solve the SI, PI, and EMI problems and provides an overview of the existing electromagnetic modeling methods used in electronic chips, package, and PCB. The text also addresses the limitations individuals in the real-world engineering community face for design engineers, researchers, postgraduates, postdoctoral researchers, university professors, and consultants"-- |
| first_indexed | 2024-03-05T11:57:43Z |
| format | |
| id | KOHA-OAI-TEST:469283 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T11:57:43Z |
| publishDate | c201 |
| publisher | Hoboken, N.J. : Wiley-IEEE Press, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4692832020-12-19T17:17:14ZElectrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / 529862 Li, Er-Ping Hoboken, N.J. : Wiley-IEEE Press,c2012.eng"The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book presents a number of special methods to solve the SI, PI, and EMI problems and provides an overview of the existing electromagnetic modeling methods used in electronic chips, package, and PCB. The text also addresses the limitations individuals in the real-world engineering community face for design engineers, researchers, postgraduates, postdoctoral researchers, university professors, and consultants"--"The book attempts to systematically present a series of fast efficient electromagnetic modeling techniques to readers involved in the design and analysis of the large and complex electronic structures. The book will present a number of special methods to solve the SI, PI, and EMI problems. The book will provide an overview of the existing electromagnetic modeling methods used in electronic chips, package and PCB, and address the limitations individuals in the real-world engineering community face"--"The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book presents a number of special methods to solve the SI, PI, and EMI problems and provides an overview of the existing electromagnetic modeling methods used in electronic chips, package, and PCB. The text also addresses the limitations individuals in the real-world engineering community face for design engineers, researchers, postgraduates, postdoctoral researchers, university professors, and consultants"--"The book attempts to systematically present a series of fast efficient electromagnetic modeling techniques to readers involved in the design and analysis of the large and complex electronic structures. The book will present a number of special methods to solve the SI, PI, and EMI problems. The book will provide an overview of the existing electromagnetic modeling methods used in electronic chips, package and PCB, and address the limitations individuals in the real-world engineering community face"--PSZJBLThree-dimensional integrated circuitsURN:ISBN:9780470623466 (hardback) |
| spellingShingle | Three-dimensional integrated circuits 529862 Li, Er-Ping Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / |
| title | Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / |
| title_full | Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / |
| title_fullStr | Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / |
| title_full_unstemmed | Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / |
| title_short | Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / |
| title_sort | electrical modeling and design for 3d integration 3d integrated circuits and packaging signal integrity power integrity and emc |
| topic | Three-dimensional integrated circuits |
| work_keys_str_mv | AT 529862lierping electricalmodelinganddesignfor3dintegration3dintegratedcircuitsandpackagingsignalintegritypowerintegrityandemc |