Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC /
"The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book presents a...
Main Author: | 529862 Li, Er-Ping |
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Format: | |
Language: | eng |
Published: |
Hoboken, N.J. : Wiley-IEEE Press,
c201
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Subjects: |
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