Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes /

Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes /

Thesis (Doktor Falsafah (Kejuruteraan Mekanikal)) - Universiti Teknologi Malaysia, 2012

Bibliographic Details
Main Authors:	Saliza Azlina Osman, 1982-, Ali Ourdjini, Astuty Amrin, supervisor, Fakulti Kejuruteraan Mekanikal
Format:
Language:	eng
Published:	2012
Subjects:	Solder and soldering Intermetallic compounds

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