Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] /

Παρόμοια τεκμήρια

• Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model /
  ανά: Aliff Farhan Mohd. Yamin, 1986-, κ.ά.
  Έκδοση: (2012)
• Classical and damage mechanics-based models for lead-free solder interconnects /
  ανά: Lai, Zheng Bo, 1984-, κ.ά.
  Έκδοση: (2010)
• Classical and damage mechanics-based models for lead-free solder interconnects [electronic resource] /
  ανά: Lai, Zheng Bo, 1984-, κ.ά.
  Έκδοση: (2009)
• Solder joint reliability prediction for multiple environments /
  ανά: 185890 Perkins, Andrew E., κ.ά.
  Έκδοση: (2008)
• Electronic assembly : soft soldering and wire wrapping /
  ανά: 365987 Herrick, Gerry
  Έκδοση: (1992)