Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] /
Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2012
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| Language: | eng |
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2012
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| _version_ | 1826456531968720896 |
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| author | Aliff Farhan Mohd. Yamin, 1986- |
| author_facet | Aliff Farhan Mohd. Yamin, 1986- |
| author_sort | Aliff Farhan Mohd. Yamin, 1986- |
| collection | OCEAN |
| description | Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2012 |
| first_indexed | 2024-03-05T13:23:42Z |
| format | |
| id | KOHA-OAI-TEST:497906 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T13:23:42Z |
| publishDate | 2012 |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4979062020-12-19T17:18:24ZDynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] / Aliff Farhan Mohd. Yamin, 1986- 2012engThesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2012Includes bibliographical referencesPSZJBLElectronic apparatus and appliancesJoints (Engineering)Solder and soldering |
| spellingShingle | Electronic apparatus and appliances Joints (Engineering) Solder and soldering Aliff Farhan Mohd. Yamin, 1986- Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] / |
| title | Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] / |
| title_full | Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] / |
| title_fullStr | Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] / |
| title_full_unstemmed | Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] / |
| title_short | Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] / |
| title_sort | dynamic fracture process of solder intermetallic interface in lead free solder interconnects using cohesive zone model electronic resource |
| topic | Electronic apparatus and appliances Joints (Engineering) Solder and soldering |
| work_keys_str_mv | AT alifffarhanmohdyamin1986 dynamicfractureprocessofsolderintermetallicinterfaceinleadfreesolderinterconnectsusingcohesivezonemodelelectronicresource |