Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] /

Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2012

Bibliographic Details
Main Author: Aliff Farhan Mohd. Yamin, 1986-
Format:
Language:eng
Published: 2012
Subjects:
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author Aliff Farhan Mohd. Yamin, 1986-
author_facet Aliff Farhan Mohd. Yamin, 1986-
author_sort Aliff Farhan Mohd. Yamin, 1986-
collection OCEAN
description Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2012
first_indexed 2024-03-05T13:23:42Z
format
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institution Universiti Teknologi Malaysia - OCEAN
language eng
last_indexed 2024-03-05T13:23:42Z
publishDate 2012
record_format dspace
spelling KOHA-OAI-TEST:4979062020-12-19T17:18:24ZDynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] / Aliff Farhan Mohd. Yamin, 1986- 2012engThesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2012Includes bibliographical referencesPSZJBLElectronic apparatus and appliancesJoints (Engineering)Solder and soldering
spellingShingle Electronic apparatus and appliances
Joints (Engineering)
Solder and soldering
Aliff Farhan Mohd. Yamin, 1986-
Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] /
title Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] /
title_full Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] /
title_fullStr Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] /
title_full_unstemmed Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] /
title_short Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] /
title_sort dynamic fracture process of solder intermetallic interface in lead free solder interconnects using cohesive zone model electronic resource
topic Electronic apparatus and appliances
Joints (Engineering)
Solder and soldering
work_keys_str_mv AT alifffarhanmohdyamin1986 dynamicfractureprocessofsolderintermetallicinterfaceinleadfreesolderinterconnectsusingcohesivezonemodelelectronicresource