Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] /
Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2012
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Language: | eng |
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2012
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author | Aliff Farhan Mohd. Yamin, 1986- |
author_facet | Aliff Farhan Mohd. Yamin, 1986- |
author_sort | Aliff Farhan Mohd. Yamin, 1986- |
collection | OCEAN |
description | Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2012 |
first_indexed | 2024-03-05T13:23:42Z |
format | |
id | KOHA-OAI-TEST:497906 |
institution | Universiti Teknologi Malaysia - OCEAN |
language | eng |
last_indexed | 2024-03-05T13:23:42Z |
publishDate | 2012 |
record_format | dspace |
spelling | KOHA-OAI-TEST:4979062020-12-19T17:18:24ZDynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] / Aliff Farhan Mohd. Yamin, 1986- 2012engThesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2012Includes bibliographical referencesPSZJBLElectronic apparatus and appliancesJoints (Engineering)Solder and soldering |
spellingShingle | Electronic apparatus and appliances Joints (Engineering) Solder and soldering Aliff Farhan Mohd. Yamin, 1986- Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] / |
title | Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] / |
title_full | Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] / |
title_fullStr | Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] / |
title_full_unstemmed | Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] / |
title_short | Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] / |
title_sort | dynamic fracture process of solder intermetallic interface in lead free solder interconnects using cohesive zone model electronic resource |
topic | Electronic apparatus and appliances Joints (Engineering) Solder and soldering |
work_keys_str_mv | AT alifffarhanmohdyamin1986 dynamicfractureprocessofsolderintermetallicinterfaceinleadfreesolderinterconnectsusingcohesivezonemodelelectronicresource |