$Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] /$

Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] /

Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2012

Bibliographic Details
Main Author:	Aliff Farhan Mohd. Yamin, 1986-
Format:
Language:	eng
Published:	2012
Subjects:	Electronic apparatus and appliances Joints (Engineering) Solder and soldering

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