Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes /

Bibliographic Details
Main Authors:	Ali Ourdjini, author, Universiti Teknologi Malaysia. Fakulti Kejuruteraan Mekanikal
Format:
Language:	eng
Published:	Johor Bahru, Johor : Universiti Teknologi Malaysia, 2011
Subjects:	Electronic packaging

Interfacial reactions during soldering of Sn - Ag - Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes /
by: Siti Rabiatull Aisha Idris, 1983-, et al.
Published: (2008)

Interfacial reactions during soldering of Sn - Ag - Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes [electronic resource] /
by: Siti Rabiatull Aisha Idris, 1983-, et al.
Published: (2008)

Interfacial reaction during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel /immersion gold surface finishes /
by: 183648 Ali Ourdjini, et al.
Published: (2007)

Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
by: Idris, Siti Rabiatull Aisha
Published: (2008)

Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold /
by: Ng, Mei Wah, 1986-, et al.
Published: (2010)

Study of interfacial reactions between lead-free solders and immersion silver finish /
by: Safoura Oshaghi, 1977-, et al.
Published: (2008)

Interfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish /
by: Nor Diyana Mutalif, 1985-, et al.
Published: (2008)

Intermetallics formed between Sn-Ag-Cu solders and electroless nickel/ electroless palladium/ immersion gold surface finish /
by: Lock, Poh Choo, 1987-, et al.
Published: (2010)

Intermetallic compound in lead free solder on electroless nickel/immersion gold surface finish /
by: 458141 Mah, Chia Wen
Published: (2003)

Interfacial reactions between lead - free solders and electroless nickel/immersion gold (ENIG) surface finish /
by: Boo, Nan Shing, 1981-, et al.
Published: (2010)

Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes /
by: 576681 Nor Akmal Fadil, et al.
Published: (2007)

Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish /
by: Chong, Phey Shan, 1988-, et al.
Published: (2012)

Study of interfacial reactions between lead-free solders and immersion silver finish [electronic resource] /
by: Safoura Oshaghi, 1977-, et al.
Published: (2008)

Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] /
by: Chong, Phey Shan, 1988-, et al.
Published: (2012)

Interfacial reactions between lead-free solders and electroless nickel/immersion gold surface finish /
by: Mohd. Muzamir Mahat, 1986-, et al.
Published: (2009)

Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold [electronic resource] /
by: Ng, Mei Wah, 1986-
Published: (2010)

Study of interfacial reation during reflow soldering of Sn- Ag - Cu lead - free solders on bare copper and immersion silver surface finishes /
by: Nurfazlin Abu Hassan, 1984-, et al.
Published: (2009)

Interfacial reactions during soldering between lead-free solders and immersion silver surface finish /
by: Tyah, Jun Hao, 1985-, et al.
Published: (2009)

Effect of Ni-doping on intermetallics between Sn-3Ag-0.5Cu solders with electroless nickel/immersion gold(ENIG) surface finish /
by: Siti Zahira Yusof, 1989-, et al.
Published: (2012)

Interfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish [electronic resource] /
by: Nor Diyana Mutalif, 1985-
Published: (2008)

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish /
by: 458317 Liew, Chung Wah, et al.
Published: (2007)

The interfacial reactions between lead-free solder and immersion silver finish /
by: Nor Afiza Khamis, 1985-, et al.
Published: (2008)

Intermetallics formed between Sn-Ag-Cu solders and electroless nickel/ electroless palladium/ immersion gold surface finish [electronic resource] /
by: Lock, Poh Choo, 1987-
Published: (2010)

Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
by: Boo, Nan Shing
Published: (2010)

Interfacial reactions between lead - free solders and electroless nickel/immersion gold (ENIG) surface finish [electronic resource] /
by: Boo, Nan Shing, 1981-, et al.
Published: (2010)

Effect of Ni-doping on intermetallics between Sn-3Ag-0.5Cu solders with electroless nickel/immersion gold(ENIG) surface finish [electronic resources] /
by: Siti Zahira Yusof, 1989-, et al.
Published: (2012)

Interfacial reactions between lead-free solders and electroless nickel/immersion gold surface finish [electronic resource] /
by: Mohd. Muzamir Mahat, 1986-, et al.
Published: (2009)

Effect of solder bump size on intermetallic compound formation between solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish [microfilm] /
by: Fakulti Kejuruteraan Mekanikal
Published: (2006)

Effect of nickle doping in Sn-Ag-Cu solders on intermetallics formed during soldering on direct immersion gold (DIG) surface finish /
by: Ng, Theng Pin, 1987-, et al.
Published: (2011)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish /
by: 200265 Moey, Chin Boon
Published: (2005)

Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes [electronic resource] /
by: 576681 Nor Akmal Fadil
Published: (2007)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [microfilm] /
by: Moey, Chin Boon
Published: (2006)

Effect of solder bump size on intermetallic compound formation between solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish /
by: 380319 Ching, Sze Pei
Published: (2006)

Formation of intermetallic compound between Sn-Ag-Cu solders and direct immersion gold (DIG) surface finish /
by: Chia, Xing Nian, 1987-, et al.
Published: (2011)

Experimental and simulation study on lead-free solders and electroless nickel immersion silver surface finish
by: Hashim, Muhammad Syafiq
Published: (2023)

Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
by: Mohamed Anuar, Rabiatul Adawiyah
Published: (2017)

Interfacial analysis of carbon nanotubes-reinforced and graphene-reinforced Sn-1.0Ag-0.5Cu solder on electroless nickel/ immersion silver surface finish
by: Krishna, Vidyatharran
Published: (2020)

Effect of nickle doping in Sn-Ag-Cu solders on intermetallics formed during soldering on direct immersion gold (DIG) surface finish [electronic resource] /
by: Ng, Theng Pin, 1987-, et al.
Published: (2011)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] /
by: 200265 Moey, Chin Boon
Published: (2005)

Intermetallic formation during soldering between lead-free solders and immersion silver surface finish /
by: Ch'ng, Emily Huey Ling, 1984-, et al.
Published: (2007)

Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes /

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