Handbook of 3D integration : technology and applications of 3D integrated circuits /

Handbook of 3D integration : technology and applications of 3D integrated circuits /

Includes bibliographical references and index

书目详细资料
Main Authors: Garrou, Philip E., editor, Bower, Christopher Andrew, editor, Ramm, Peter, editor
格式:
语言:eng
出版: Weinheim : Wiley-VCH, 2012
主题:
Integrated circuits
Semiconductor wafers
Three-dimensional imaging
实物特征
总结:Includes bibliographical references and index

相似书籍