Handbook of 3D integration : technology and applications of 3D integrated circuits /

Handbook of 3D integration : technology and applications of 3D integrated circuits /

Includes bibliographical references and index

Bibliographic Details
Main Authors: Garrou, Philip E., editor, Bower, Christopher Andrew, editor, Ramm, Peter, editor
Format:
Language:eng
Published: Weinheim : Wiley-VCH, 2012
Subjects:
Integrated circuits
Semiconductor wafers
Three-dimensional imaging
Description
Summary:Includes bibliographical references and index

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