Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics /
| Main Authors: | , , |
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| Format: | text |
| Language: | eng |
| Published: |
Johor Bahru, Johor : Universiti Teknologi Malaysia,
2018
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| Online Access: | http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:109666 |
| Summary: |
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