Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics /
Main Authors: | , , |
---|---|
Format: | text |
Sprog: | eng |
Udgivet: |
Johor Bahru, Johor : Universiti Teknologi Malaysia,
2018
|
Online adgang: | http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:109666 |
Summary: |
---|