Electronic Packaging Interconnect Technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : Selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan /

Electronic Packaging Interconnect Technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : Selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan /

This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect mat...

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Dades bibliogràfiques
Autors principals: Electronic Packaging Interconnect Technology Symposium (2017 : Fukuoka-ken, Japan), Nogita, Kauhiro, editor, Mohd. Arif Anuar Mohd. Salleh, editor, Mohd. Mustafa Al Bakri Abdullah, editor, Liyana Jamaludin, editor, Muhammad Faheem Mohd. Tahir, editor
Format:
Idioma:eng
Publicat: Zurich, Switzerland : Trans Tech Publications Ltd., 2018
Matèries:
Electronic packaging
Interconnects (Integrated circuit technology)
Descripció
Sumari:This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research. Solder, Solder Alloys, Lead-Free Solder Alloys, Interconnection, Mechanical Properties, Corrosion, Whisker Growth, Liquid Structure, Intermetallic Compounds, Solidification, Polymers, Photochemistry, Chemical Technologies, Brazing Materials Science

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