Thermal aging test on metallic underlayer deposited between silicon wafer and copper interconnection filler for TSV application /

Bibliographic Details
Main Authors:	Nazila Najwa Iskak, 1996-, author, Nor Akmal Fadil, supervisor 576681, Fakulti Kejuruteraan. Sekolah Kejuruteraan Mekanikal 619080
Format:
Language:	eng
Published:	Johor Bahru, Johor : Universiti Teknologi Malaysia, 2019
Subjects:	Semiconductors Technological innovations

Thermal aging test on metallic underlayer deposited between silicon wafer and copper interconnection filler for TSV application / by Nazila Najwa Iskak, 1996-, author

Published 2019