MECHANICAL ANALYSIS OF ELECTRONIC PACKAGING SYSTEMS /

"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achie...

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Bibliographic Details
Main Author: McKeown, Stephen A., author
Format:
Language:eng
Published: Boca Raton, FL : CRC Press, Taylor & Francis, 2019
Subjects:

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