Teknologi fabrikasi litar bersepadu /

Teknologi fabrikasi litar bersepadu /

Afficher d'autres versions (1)

16

Détails bibliographiques
Auteur principal:	Burhanuddin Yeop Majlis, editor
Format:
Langue:	may
Publié:	Bangi : Penerbit UKM, 2001
Sujets:	Power semiconductors Semiconductors Printed circuits

Documents similaires

Peranti dan litar analog /
par: Burhanuddin Yeop Majlis, editor
Publié: (1992)

Teknologi fabrikasi litar bersepadu /
par: Burhanuddin Yeop Majlis, editor
Publié: (2000)

Perusahaan fabrikasi papan litar tercetak (printed circuit boards) /
par: 5465 Bank Pembangunan Malaysia Berhad
Publié: (1995)

Pembangunan perisian untuk merekabentuk dan menguji papan litar bercetak /
par: 192419 Ahmad Arshad Abdul Aziz
Publié: (1991)

Toxic waste minimization in the printed circuit board industry /
par: 361752 Nunno, T.
Publié: (1988)

Pengolahan sisa industri pembuatan litar bersepadu (PCB) /
par: 382588 Sivaneson Muniandy
Publié: (1997)

Kursus rekabentuk papan litar tercetak menggunakan OrCAD SDT III/OrCAD PCB II /
par: Kursus Rekabentuk Papan Litar Tercetak Menggunakan OrCAD SDT 111/OrCAD PCB 11 (1994 : Tronoh), et autres
Publié: (1994)

Printed organic and molecular electronics /
par: Gamota, Daniel
Publié: (2004)

Pengenapan nikel tanpa elektrod ke atas papan percetakan litar tulen /
par: 204990 Mok, Hang Liew
Publié: (2002)

Vibration behavior of printed circuit boards used in electronics applications /
par: 458291 Vijay Anand Ramadass
Publié: (2006)

Morphological image segmentation for detection and classification of PCB defects [electronic resource] /
par: 295624 Siti Hazurah Indera Putera
Publié: (2007)

Vibration behavior of printed circuit boards used in electronics applications [electronic resource] /
par: 458291 Vijay Anand Ramadass
Publié: (2006)

Printed circuit board materials handbook /
par: Jawitz, Martin W.
Publié: (1997)

Printed circuits of assessed quality : generic data and methods of test : capability approval procedure and rules
par: 8096 British Standards Institution

Sectional specification for capability approval of manufacturers of single - or double-sided printed wiring boards of assessed quality without plated through holes
par: 8096 British Standards Institution

Sectional specification for capability approval of manufacturers of single - or double-sided flexible printed wiring boards of assessed quality without through hole connections and with or without rigidizing component materials
par: 8096 British Standards Institution

Sectional specification for capability approval of manufacturers of double-sided flexible printed wiring boards of assessed quality with through hole connections and with or without rigidizing component materials
par: 8096 British Standards Institution

Morphological image segmentation for detection and classification of PCB defects /
par: 295624 Siti Hazurah Indera Putera
Publié: (2007)

Handbook of printed circuit design, manufacture, components and assembly/
par: 204052 Leonida, Giovanni
Publié: (1981)

Membina litar pendarab menggunakan teknologi BICMOS /
par: 387039 Siti Suhaila Mohd. Nawi
Publié: (2001)

Asas teknologi litar bersepadu/
par: 317002 Fortino, Andres G., et autres
Publié: (1989)

Perusahaan papan litar tercetak : pautan permukaan /
par: 5465 Bank Pembangunan Malaysia Berhad
Publié: (1997)

Analisa rekabentuk mencetak tanpa wayar /
par: 309760 Norazah Fuad @ Alfuat
Publié: (2001)

Model industri perbotolan air /
par: 253378 Azam Syah Monzaid
Publié: (2006)

Rekabentuk dan fabrikasi amplifier hingar rendah sebagai satu peranti MMIC gallium arsenida /
par: 313598 Salizul Jaafar
Publié: (2000)

Pemelarutan papan litar bercetak dan penentuan kandungan logam dengan kaedah spektroskopi serapan atom /
par: 175514 Vilasini Rajaram
Publié: (2001)

Printed circuits handbook / [cakera padat]
par: Coombs, Clyde F.
Publié: (2001)

Printed circuits handbook /
par: Coombs, Clyde F.
Publié: (2001)

Printed circuits and space technology : design and application/
par: 412696 Linden, Albert E.
Publié: (1962)

Harmonized system of quality assessment for electronic components : capability detail specification : multilayer printed boards
par: 8096 British Standards Institution, et autres

Printed circuit assembly design/
par: 214480 Marks, Leornard, et autres
Publié: (2000)

In-circuit testing/
par: 365160 Bateson, John
Publié: (1985)

Manufacturing of multilayer Printed Circuit Boards (PCB) /
par: 239924 Chen, Yau Weng
Publié: (2006)

High performance printed circuit boards /
par: Harper, Charles A.
Publié: (2000)

Generation of precision artwork for printed circuit boards/
par: 406552 Lund, Preben
Publié: (1978)

10-minute test techniques for PC servicing /
par: 406571 Margolis, Art
Publié: (1973)

Modern circuit technology : metal finishing processes in printed circuits and electronic assemblies/
par: 406633 Ross, W. Macleod
Publié: (1975)

Electronics soldering : printed circuit [filem jalur]
Publié: (1981)

Printed circuits of assessed quality : sectional specification for multilayer flexi-rigid printed circuits with through hole connections
par: 8096 British Standards Institution

Micro drilling of printed circuit boards /
par: 394831 Teoh, Chee Wooi
Publié: (2000)