Vacuum Engineering /

Ultra-high vacuum (UHV) is the vacuum regime characterised by pressures lower than about 10−7 pascal or 100 nanopascals (10−9 mbar, ~10−9 torr). UHV requires the use of unusual materials in construction and by heating the entire system to 180°C for several hours ("baking") to remove water...

Full description

Bibliographic Details
Main Author: Madrigal, Mercy author 643720
Format: text
Language:eng
Published: Delhi, India : World Technologies, 2012
Subjects:
Online Access:http://repository.library.utm.my/2762
_version_ 1826470292447297536
author Madrigal, Mercy author 643720
author_facet Madrigal, Mercy author 643720
author_sort Madrigal, Mercy author 643720
collection OCEAN
description Ultra-high vacuum (UHV) is the vacuum regime characterised by pressures lower than about 10−7 pascal or 100 nanopascals (10−9 mbar, ~10−9 torr). UHV requires the use of unusual materials in construction and by heating the entire system to 180°C for several hours ("baking") to remove water and other trace gases which adsorb on the surfaces of the chamber. At these low pressures the mean free path of a gas molecule is approximately 40 km, so gas molecules will collide with the chamber walls many times before colliding with each other. Almost all interactions therefore take place on various surfaces in the chamber.
first_indexed 2024-03-05T16:45:58Z
format text
id KOHA-OAI-TEST:593511
institution Universiti Teknologi Malaysia - OCEAN
language eng
last_indexed 2024-03-05T16:45:58Z
publishDate 2012
publisher Delhi, India : World Technologies,
record_format dspace
spelling KOHA-OAI-TEST:5935112022-10-25T20:54:47ZVacuum Engineering / Madrigal, Mercy author 643720 textDelhi, India : World Technologies,2012©2012engUltra-high vacuum (UHV) is the vacuum regime characterised by pressures lower than about 10−7 pascal or 100 nanopascals (10−9 mbar, ~10−9 torr). UHV requires the use of unusual materials in construction and by heating the entire system to 180°C for several hours ("baking") to remove water and other trace gases which adsorb on the surfaces of the chamber. At these low pressures the mean free path of a gas molecule is approximately 40 km, so gas molecules will collide with the chamber walls many times before colliding with each other. Almost all interactions therefore take place on various surfaces in the chamber.Ultra-high vacuum (UHV) is the vacuum regime characterised by pressures lower than about 10−7 pascal or 100 nanopascals (10−9 mbar, ~10−9 torr). UHV requires the use of unusual materials in construction and by heating the entire system to 180°C for several hours ("baking") to remove water and other trace gases which adsorb on the surfaces of the chamber. At these low pressures the mean free path of a gas molecule is approximately 40 km, so gas molecules will collide with the chamber walls many times before colliding with each other. Almost all interactions therefore take place on various surfaces in the chamber.Vacuum technologyhttp://repository.library.utm.my/2762URN:ISBN:9788132342588Remote access restricted to users with a valid UTM ID via VPN.
spellingShingle Vacuum technology
Madrigal, Mercy author 643720
Vacuum Engineering /
title Vacuum Engineering /
title_full Vacuum Engineering /
title_fullStr Vacuum Engineering /
title_full_unstemmed Vacuum Engineering /
title_short Vacuum Engineering /
title_sort vacuum engineering
topic Vacuum technology
url http://repository.library.utm.my/2762
work_keys_str_mv AT madrigalmercyauthor643720 vacuumengineering