Packaging Technology in Microfabrication /
This is a well written thorough study with an practical approach to Packaging Technology in Microfabrication.
| Main Author: | |
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| Format: | text |
| Language: | eng |
| Published: |
Delhi, India : World Technologies,
2012
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| Subjects: | |
| Online Access: | http://repository.library.utm.my/2611 |
| _version_ | 1826470366689624064 |
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| author | Calloway, Roseline, author 639919 |
| author_facet | Calloway, Roseline, author 639919 |
| author_sort | Calloway, Roseline, author 639919 |
| collection | OCEAN |
| description | This is a well written thorough study with an practical approach to Packaging Technology in Microfabrication. |
| first_indexed | 2024-03-05T16:47:06Z |
| format | text |
| id | KOHA-OAI-TEST:593892 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T16:47:06Z |
| publishDate | 2012 |
| publisher | Delhi, India : World Technologies, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:5938922022-03-30T04:23:39ZPackaging Technology in Microfabrication / Calloway, Roseline, author 639919 text Electronic books 631902 Delhi, India : World Technologies,2012©2012engThis is a well written thorough study with an practical approach to Packaging Technology in Microfabrication.Chapter 1 - Adhesive Bonding -- Chapter 2 - Anodic Bonding -- Chapter 3 - Wafer Bonding and Thermosonic Bonding -- Chapter 4 - Direct Bonding -- Chapter 5 - Eutectic Bonding -- Chapter 6 - Glass Frit Bonding -- Chapter 7 - Integrated Circuit Packaging and Low Temperature Co-Fired Ceramic -- Chapter 8 - Plasma Activated Bonding -- Chapter 9 - Reactive Bonding -- Chapter 10 - System in Package and Wire Bonding -- Chapter 11 - Thermocompression Bonding -- Chapter 12 - Three-Dimensional Integrated Circuit -- Chapter 13 - Semiconductor Package and MELF Electronic Components --Chapter 14 - Microfabrication.This is a well written thorough study with an practical approach to Packaging Technology in Microfabrication.PSZ_JBMicrofabricationPackaginghttp://repository.library.utm.my/2611URN:ISBN:9788132342021Remote access restricted to users with a valid UTM ID via VPN. |
| spellingShingle | Microfabrication Packaging Calloway, Roseline, author 639919 Packaging Technology in Microfabrication / |
| title | Packaging Technology in Microfabrication / |
| title_full | Packaging Technology in Microfabrication / |
| title_fullStr | Packaging Technology in Microfabrication / |
| title_full_unstemmed | Packaging Technology in Microfabrication / |
| title_short | Packaging Technology in Microfabrication / |
| title_sort | packaging technology in microfabrication |
| topic | Microfabrication Packaging |
| url | http://repository.library.utm.my/2611 |
| work_keys_str_mv | AT callowayroselineauthor639919 packagingtechnologyinmicrofabrication |