Damage mechanics-based model for reliability assessment of through-silicon via interconnects /

Damage mechanics-based model for reliability assessment of through-silicon via interconnects /

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Bibliographic Details
Main Authors:	Mohammad Amirul Affiz Afripin, 1987-, author 541882, Mohd. Nasir Tamin, supervisor 304103, Nor Akmal Fadil, supervisor 576681, Fakulti Kejuruteraan - Sekolah Kejuruteraan Mekanikal 619080
Format:	text
Language:	eng
Published:	Johor Bahru, Johor : Universiti Teknologi Malaysia, 2020
Subjects:	Subject
Online Access:	http://dms.library.utm.my:8080

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