Damage mechanics-based model for reliability assessment of through-silicon via interconnects /
Main Authors: | Mohammad Amirul Affiz Afripin, 1987-, author 541882, Mohd. Nasir Tamin, supervisor 304103, Nor Akmal Fadil, supervisor 576681, Fakulti Kejuruteraan - Sekolah Kejuruteraan Mekanikal 619080 |
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Format: | text |
Language: | eng |
Published: |
Johor Bahru, Johor : Universiti Teknologi Malaysia,
2020
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Subjects: | |
Online Access: | http://dms.library.utm.my:8080 |
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