Damage mechanics-based model for reliability assessment of through-silicon via interconnects /

Damage mechanics-based model for reliability assessment of through-silicon via interconnects /

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Bibliographic Details
Main Author: Mohammad Amirul Affiz Afripin, 1987-, author 541882
Format: text
Language:eng
Published: Johor Bahru, Johor : Universiti Teknologi Malaysia, 2020
Subjects:
Subject

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