Characterisation of electroless deposition parameter of copper on silicon wafer for through silicon via application /

Bibliographic Details
Main Author: Shazatul Akmaliah Mior Shahidin, 1982-, author 291310
Format: software, multimedia
Language:eng
Published: Johor Bahru, Johor : Universiti Teknologi Malaysia, 2019
Subjects:
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author Shazatul Akmaliah Mior Shahidin, 1982-, author 291310
author_facet Shazatul Akmaliah Mior Shahidin, 1982-, author 291310
author_sort Shazatul Akmaliah Mior Shahidin, 1982-, author 291310
collection OCEAN
description
first_indexed 2024-03-05T17:04:02Z
format software, multimedia
id KOHA-OAI-TEST:599702
institution Universiti Teknologi Malaysia - OCEAN
language eng
last_indexed 2024-03-05T17:04:02Z
publishDate 2019
publisher Johor Bahru, Johor : Universiti Teknologi Malaysia,
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spelling KOHA-OAI-TEST:5997022023-10-11T03:33:54ZCharacterisation of electroless deposition parameter of copper on silicon wafer for through silicon via application / Shazatul Akmaliah Mior Shahidin, 1982-, author 291310 software, multimediaJohor Bahru, Johor : Universiti Teknologi Malaysia,2019engBibliography: p. 103-110.KK-FK_SKMSubjectSubject
spellingShingle Subject
Subject
Shazatul Akmaliah Mior Shahidin, 1982-, author 291310
Characterisation of electroless deposition parameter of copper on silicon wafer for through silicon via application /
title Characterisation of electroless deposition parameter of copper on silicon wafer for through silicon via application /
title_full Characterisation of electroless deposition parameter of copper on silicon wafer for through silicon via application /
title_fullStr Characterisation of electroless deposition parameter of copper on silicon wafer for through silicon via application /
title_full_unstemmed Characterisation of electroless deposition parameter of copper on silicon wafer for through silicon via application /
title_short Characterisation of electroless deposition parameter of copper on silicon wafer for through silicon via application /
title_sort characterisation of electroless deposition parameter of copper on silicon wafer for through silicon via application
topic Subject
Subject
work_keys_str_mv AT shazatulakmaliahmiorshahidin1982author291310 characterisationofelectrolessdepositionparameterofcopperonsiliconwaferforthroughsiliconviaapplication