Temperature and strain-rate dependent damage-based models for lead-free solder interconnects /

Bibliographic Details
Main Authors: Siti Faizah Mad Asasaari, 1987-, author 641413, Mohd. Nasir Tamin supervisor 304103, Nor Akmal Fadil, supervisor 576681, Fakulti Kejuruteraan - Sekolah Kejuruteraan Mekanikal 619080
Format: text
Language:eng
Published: Johor Bahru, Johor : Universiti Teknologi Malaysia, 2021
Subjects:

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