Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /
16
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| Format: | |
| Published: |
New York : McGraw-Hill,
2000
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| Subjects: |
| _version_ | 1796658071418699776 |
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| author | 303750 Lau, John H. |
| author_facet | 303750 Lau, John H. |
| author_sort | 303750 Lau, John H. |
| collection | OCEAN |
| description | 16 |
| first_indexed | 2024-03-04T15:43:48Z |
| format | |
| id | KOHA-OAI-TEST:65041 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| last_indexed | 2024-03-04T15:43:48Z |
| publishDate | 2000 |
| publisher | New York : McGraw-Hill, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:650412020-12-19T16:59:27ZLow cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / 303750 Lau, John H. New York : McGraw-Hill,200016PSZKLLMultichip modules (Microelectronics)Microelectronic packagingURN:ISBN:0071351418 |
| spellingShingle | Multichip modules (Microelectronics) Microelectronic packaging 303750 Lau, John H. Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / |
| title | Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / |
| title_full | Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / |
| title_fullStr | Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / |
| title_full_unstemmed | Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / |
| title_short | Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / |
| title_sort | low cost flip chip technologies for dca wlcsp and pbga assemblies |
| topic | Multichip modules (Microelectronics) Microelectronic packaging |
| work_keys_str_mv | AT 303750laujohnh lowcostflipchiptechnologiesfordcawlcspandpbgaassemblies |