Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

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Bibliographic Details
Main Author: 303750 Lau, John H.
Format:
Published: New York : McGraw-Hill, 2000
Subjects:
Multichip modules (Microelectronics)
Microelectronic packaging

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