Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

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Bibliographic Details
Main Author:	303750 Lau, John H.
Format:
Published:	New York : McGraw-Hill, 2000
Subjects:	Multichip modules (Microelectronics) Microelectronic packaging

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