Shangguan, D. (2005). Lead-free solder interconnect reliability. Materials Park, OH : ASM International.
Cita Chicago (17th ed.)Shangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.
Cita MLA (9th ed.)Shangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.
Atenció: Aquestes cites poden no estar 100% correctes.