Dyfyniad APA

Shangguan, D. (2005). Lead-free solder interconnect reliability. Materials Park, OH : ASM International.

Dyfyniad Arddull Chicago

Shangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.

Dyfyniad MLA

Shangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.

Rhybudd: Mae'n bosib nad yw'r dyfyniadau hyn bob amser yn 100% cywir.