Cita APA (7a ed.)

Shangguan, D. (2005). Lead-free solder interconnect reliability. Materials Park, OH : ASM International.

Cita Chicago Style (17a ed.)

Shangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.

Cita MLA (9a ed.)

Shangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.

Precaución: Estas citas no son 100% exactas.