Shangguan, D. (2005). Lead-free solder interconnect reliability. Materials Park, OH : ASM International.
Chicago-viite (17. p.)Shangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.
MLA-viite (9. p.)Shangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.
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