Lua APA (7ú heag.)

Shangguan, D. (2005). Lead-free solder interconnect reliability. Materials Park, OH : ASM International.

Lua i Stíl Chicago (17ú heag.)

Shangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.

Lua MLA (9ú heag.)

Shangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.

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