Shangguan, D. (2005). Lead-free solder interconnect reliability. Materials Park, OH : ASM International.
Citación estilo ChicagoShangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.
Cita MLAShangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.
Warning: These citations may not always be 100% accurate.