APA ציטוט

Shangguan, D. (2005). Lead-free solder interconnect reliability. Materials Park, OH : ASM International.

Chicago Style (17th ed.) Citation

Shangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.

ציטוט MLA

Shangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.

אזהרה: ציטוטים אלה לעיתים לא מדויקים ב 100%.