APA (7e ed.) Bronvermelding

Shangguan, D. (2005). Lead-free solder interconnect reliability. Materials Park, OH : ASM International.

Chicago (17e ed.) Bronvermelding

Shangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.

MLA (9e ed.) Bronvermelding

Shangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.

Let op: Deze citaties zijn niet altijd 100% accuraat.