Shangguan, D. (2005). Lead-free solder interconnect reliability. Materials Park, OH : ASM International.
Chicago Style (17th ed.) CitationShangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.
MLA引文Shangguan, Dongkai. Lead-free Solder Interconnect Reliability. Materials Park, OH : ASM International, 2005.
警告:這些引文格式不一定是100%准確.