Experimental simulation of thermal conduction in an electronic component /

Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2000

Bibliographic Details
Main Author: 394592 Pui, Hon Hwa
Format:
Language:eng
Published: Universiti Teknologi Malaysia, 2000
Subjects:
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author 394592 Pui, Hon Hwa
author_facet 394592 Pui, Hon Hwa
author_sort 394592 Pui, Hon Hwa
collection OCEAN
description Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2000
first_indexed 2024-03-04T16:47:29Z
format
id KOHA-OAI-TEST:86262
institution Universiti Teknologi Malaysia - OCEAN
language eng
last_indexed 2024-03-04T16:47:29Z
publishDate 2000
publisher Universiti Teknologi Malaysia,
record_format dspace
spelling KOHA-OAI-TEST:862622020-12-19T17:00:49ZExperimental simulation of thermal conduction in an electronic component / 394592 Pui, Hon Hwa Universiti Teknologi Malaysia,2000engProject Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 200006PRZSLThermal analysisElectronic components
spellingShingle Thermal analysis
Electronic components
394592 Pui, Hon Hwa
Experimental simulation of thermal conduction in an electronic component /
title Experimental simulation of thermal conduction in an electronic component /
title_full Experimental simulation of thermal conduction in an electronic component /
title_fullStr Experimental simulation of thermal conduction in an electronic component /
title_full_unstemmed Experimental simulation of thermal conduction in an electronic component /
title_short Experimental simulation of thermal conduction in an electronic component /
title_sort experimental simulation of thermal conduction in an electronic component
topic Thermal analysis
Electronic components
work_keys_str_mv AT 394592puihonhwa experimentalsimulationofthermalconductioninanelectroniccomponent