Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish /
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2006
| Main Authors: | , , |
|---|---|
| Format: | |
| Language: | eng |
| Published: |
2006
|
| Subjects: |
| _version_ | 1826372717529530368 |
|---|---|
| author | 288113 Siti Rabiatull Aisha Idris Ali Ourdjini Fakulti Kejuruteraan Mekanikal |
| author_facet | 288113 Siti Rabiatull Aisha Idris Ali Ourdjini Fakulti Kejuruteraan Mekanikal |
| author_sort | 288113 Siti Rabiatull Aisha Idris |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2006 |
| first_indexed | 2024-03-04T16:52:29Z |
| format | |
| id | KOHA-OAI-TEST:87943 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-04T16:52:29Z |
| publishDate | 2006 |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:879432020-12-19T17:00:53ZEffect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish / 288113 Siti Rabiatull Aisha Idris Ali Ourdjini Fakulti Kejuruteraan Mekanikal 2006engProject Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2006Includes bibliographical referencesFEMELIntermetallic compoundsSolder and soldering |
| spellingShingle | Intermetallic compounds Solder and soldering 288113 Siti Rabiatull Aisha Idris Ali Ourdjini Fakulti Kejuruteraan Mekanikal Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish / |
| title | Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish / |
| title_full | Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish / |
| title_fullStr | Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish / |
| title_full_unstemmed | Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish / |
| title_short | Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish / |
| title_sort | effect of multiple reflow and solder bump size solder on intermetallic compound formation between sn 4ag 0 5cu and enig surface finish |
| topic | Intermetallic compounds Solder and soldering |
| work_keys_str_mv | AT 288113sitirabiatullaishaidris effectofmultiplereflowandsolderbumpsizesolderonintermetalliccompoundformationbetweensn4ag05cuandenigsurfacefinish AT aliourdjini effectofmultiplereflowandsolderbumpsizesolderonintermetalliccompoundformationbetweensn4ag05cuandenigsurfacefinish AT fakultikejuruteraanmekanikal effectofmultiplereflowandsolderbumpsizesolderonintermetalliccompoundformationbetweensn4ag05cuandenigsurfacefinish |