An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures /
Thesis (PhD) in Mechanical Engineering - University of New Hampshire, 2001
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Language: | eng |
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Hampshire : University of New Hampshire,
2001
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author | 209526 Nazri Kamsah |
author_facet | 209526 Nazri Kamsah |
author_sort | 209526 Nazri Kamsah |
collection | OCEAN |
description | Thesis (PhD) in Mechanical Engineering - University of New Hampshire, 2001 |
first_indexed | 2024-03-04T17:14:59Z |
format | |
id | KOHA-OAI-TEST:95501 |
institution | Universiti Teknologi Malaysia - OCEAN |
language | eng |
last_indexed | 2024-03-04T17:14:59Z |
publishDate | 2001 |
publisher | Hampshire : University of New Hampshire, |
record_format | dspace |
spelling | KOHA-OAI-TEST:955012020-12-19T17:01:15ZAn experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures / 209526 Nazri Kamsah Hampshire : University of New Hampshire,2001engThesis (PhD) in Mechanical Engineering - University of New Hampshire, 2001Mikrofilem negatif : MFL 11906 ra16PRZSLSemiconductorsMaterials at high temperatures |
spellingShingle | Semiconductors Materials at high temperatures 209526 Nazri Kamsah An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures / |
title | An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures / |
title_full | An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures / |
title_fullStr | An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures / |
title_full_unstemmed | An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures / |
title_short | An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures / |
title_sort | experimental and finite element investigation of thermally induced inelastic deformation of single level damascene copper high density interconnect structures |
topic | Semiconductors Materials at high temperatures |
work_keys_str_mv | AT 209526nazrikamsah anexperimentalandfiniteelementinvestigationofthermallyinducedinelasticdeformationofsingleleveldamascenecopperhighdensityinterconnectstructures AT 209526nazrikamsah experimentalandfiniteelementinvestigationofthermallyinducedinelasticdeformationofsingleleveldamascenecopperhighdensityinterconnectstructures |