An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures /

Thesis (PhD) in Mechanical Engineering - University of New Hampshire, 2001

Bibliographic Details
Main Author: 209526 Nazri Kamsah
Format:
Language:eng
Published: Hampshire : University of New Hampshire, 2001
Subjects:
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author 209526 Nazri Kamsah
author_facet 209526 Nazri Kamsah
author_sort 209526 Nazri Kamsah
collection OCEAN
description Thesis (PhD) in Mechanical Engineering - University of New Hampshire, 2001
first_indexed 2024-03-04T17:14:59Z
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id KOHA-OAI-TEST:95501
institution Universiti Teknologi Malaysia - OCEAN
language eng
last_indexed 2024-03-04T17:14:59Z
publishDate 2001
publisher Hampshire : University of New Hampshire,
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spelling KOHA-OAI-TEST:955012020-12-19T17:01:15ZAn experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures / 209526 Nazri Kamsah Hampshire : University of New Hampshire,2001engThesis (PhD) in Mechanical Engineering - University of New Hampshire, 2001Mikrofilem negatif : MFL 11906 ra16PRZSLSemiconductorsMaterials at high temperatures
spellingShingle Semiconductors
Materials at high temperatures
209526 Nazri Kamsah
An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures /
title An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures /
title_full An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures /
title_fullStr An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures /
title_full_unstemmed An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures /
title_short An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures /
title_sort experimental and finite element investigation of thermally induced inelastic deformation of single level damascene copper high density interconnect structures
topic Semiconductors
Materials at high temperatures
work_keys_str_mv AT 209526nazrikamsah anexperimentalandfiniteelementinvestigationofthermallyinducedinelasticdeformationofsingleleveldamascenecopperhighdensityinterconnectstructures
AT 209526nazrikamsah experimentalandfiniteelementinvestigationofthermallyinducedinelasticdeformationofsingleleveldamascenecopperhighdensityinterconnectstructures