Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination /

Project Paper (Bachelor of Engineering (Mechanical - Production)) - Universiti Teknologi Malaysia, 2001

Bibliographic Details
Main Author: 217123 Ong, You Yang @ Bryan Ong
Format:
Language:eng
Published: Skudai : Universiti Teknologi Malaysia, 2001
Subjects:
_version_ 1796664598903914496
author 217123 Ong, You Yang @ Bryan Ong
author_facet 217123 Ong, You Yang @ Bryan Ong
author_sort 217123 Ong, You Yang @ Bryan Ong
collection OCEAN
description Project Paper (Bachelor of Engineering (Mechanical - Production)) - Universiti Teknologi Malaysia, 2001
first_indexed 2024-03-04T17:19:27Z
format
id KOHA-OAI-TEST:96947
institution Universiti Teknologi Malaysia - OCEAN
language eng
last_indexed 2024-03-04T17:19:27Z
publishDate 2001
publisher Skudai : Universiti Teknologi Malaysia,
record_format dspace
spelling KOHA-OAI-TEST:969472020-12-19T17:01:19ZAdvance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination / 217123 Ong, You Yang @ Bryan Ong Skudai : Universiti Teknologi Malaysia,2001engProject Paper (Bachelor of Engineering (Mechanical - Production)) - Universiti Teknologi Malaysia, 2001Mikrofilem negatif : MFL 11434 ra15PRZSLIntegrated circuitsMicroelectronic packaging
spellingShingle Integrated circuits
Microelectronic packaging
217123 Ong, You Yang @ Bryan Ong
Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination /
title Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination /
title_full Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination /
title_fullStr Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination /
title_full_unstemmed Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination /
title_short Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination /
title_sort advance microelectronic packaging for miniaturize package chip scale package csp sc70 series leadless package modelling production robustness determination
topic Integrated circuits
Microelectronic packaging
work_keys_str_mv AT 217123ongyouyangbryanong advancemicroelectronicpackagingforminiaturizepackagechipscalepackagecspsc70seriesleadlesspackagemodellingproductionrobustnessdetermination