Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination /
Project Paper (Bachelor of Engineering (Mechanical - Production)) - Universiti Teknologi Malaysia, 2001
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Format: | |
Language: | eng |
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Skudai : Universiti Teknologi Malaysia,
2001
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_version_ | 1796664598903914496 |
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author | 217123 Ong, You Yang @ Bryan Ong |
author_facet | 217123 Ong, You Yang @ Bryan Ong |
author_sort | 217123 Ong, You Yang @ Bryan Ong |
collection | OCEAN |
description | Project Paper (Bachelor of Engineering (Mechanical - Production)) - Universiti Teknologi Malaysia, 2001 |
first_indexed | 2024-03-04T17:19:27Z |
format | |
id | KOHA-OAI-TEST:96947 |
institution | Universiti Teknologi Malaysia - OCEAN |
language | eng |
last_indexed | 2024-03-04T17:19:27Z |
publishDate | 2001 |
publisher | Skudai : Universiti Teknologi Malaysia, |
record_format | dspace |
spelling | KOHA-OAI-TEST:969472020-12-19T17:01:19ZAdvance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination / 217123 Ong, You Yang @ Bryan Ong Skudai : Universiti Teknologi Malaysia,2001engProject Paper (Bachelor of Engineering (Mechanical - Production)) - Universiti Teknologi Malaysia, 2001Mikrofilem negatif : MFL 11434 ra15PRZSLIntegrated circuitsMicroelectronic packaging |
spellingShingle | Integrated circuits Microelectronic packaging 217123 Ong, You Yang @ Bryan Ong Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination / |
title | Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination / |
title_full | Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination / |
title_fullStr | Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination / |
title_full_unstemmed | Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination / |
title_short | Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination / |
title_sort | advance microelectronic packaging for miniaturize package chip scale package csp sc70 series leadless package modelling production robustness determination |
topic | Integrated circuits Microelectronic packaging |
work_keys_str_mv | AT 217123ongyouyangbryanong advancemicroelectronicpackagingforminiaturizepackagechipscalepackagecspsc70seriesleadlesspackagemodellingproductionrobustnessdetermination |