Lifetime Prolongation of Release Agent on Antireflection Structure Molds by Means of Partialfilling Ultraviolet Nanoimprint Lithography
Release agent becomes an imperative element in ultraviolet nanoimprint lithography (UV-NIL) for preventing the adhesive resin from adhering to the surface of antireflection structures (ARS) mold. However, complete filling the resin of a high-aspect-ratio ARS mold during UV-NIL generates a strong rel...
| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
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2015
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| Online Access: | http://umpir.ump.edu.my/id/eprint/10471/1/Lifetime%20Prolongation%20of%20Release%20Agent%20on%20Antireflection%20Structure%20Molds%20by%20Means%20of%20Partialfilling%20Ultraviolet%20Nanoimprint%20Lithography.pdf |
| _version_ | 1796990800820699136 |
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| author | Nurhafizah, Abu Talip Hayashi, Tatsuya Taniguchi, Jun Hiwasa, Shin |
| author_facet | Nurhafizah, Abu Talip Hayashi, Tatsuya Taniguchi, Jun Hiwasa, Shin |
| author_sort | Nurhafizah, Abu Talip |
| collection | UMP |
| description | Release agent becomes an imperative element in ultraviolet nanoimprint lithography (UV-NIL) for preventing the adhesive resin from adhering to the surface of antireflection structures (ARS) mold. However, complete filling the resin of a high-aspect-ratio ARS mold during UV-NIL generates a strong release force (RF) that deteriorates the release agent and shortens the lifetime of the ARS mold. In this paper, we proposed a technique of partial-filling UV-NIL in order to reduce the RF and consequently, prolong the lifetime of the release agent on ARS mold. The release and optical properties of the ARS were measured to determine the lifetime of the release agent on the mold, and complete-filling UV-NIL was also executed for comparison. By means of partial-filling UV-NIL, we successfully fabricated ARS films with excellent performance up to 75th imprint compared to complete-filling UV-NIL up to the 40th imprint. |
| first_indexed | 2024-03-06T11:56:56Z |
| format | Conference or Workshop Item |
| id | UMPir10471 |
| institution | Universiti Malaysia Pahang |
| language | English |
| last_indexed | 2024-03-06T11:56:56Z |
| publishDate | 2015 |
| record_format | dspace |
| spelling | UMPir104712018-06-28T01:09:33Z http://umpir.ump.edu.my/id/eprint/10471/ Lifetime Prolongation of Release Agent on Antireflection Structure Molds by Means of Partialfilling Ultraviolet Nanoimprint Lithography Nurhafizah, Abu Talip Hayashi, Tatsuya Taniguchi, Jun Hiwasa, Shin TK Electrical engineering. Electronics Nuclear engineering Release agent becomes an imperative element in ultraviolet nanoimprint lithography (UV-NIL) for preventing the adhesive resin from adhering to the surface of antireflection structures (ARS) mold. However, complete filling the resin of a high-aspect-ratio ARS mold during UV-NIL generates a strong release force (RF) that deteriorates the release agent and shortens the lifetime of the ARS mold. In this paper, we proposed a technique of partial-filling UV-NIL in order to reduce the RF and consequently, prolong the lifetime of the release agent on ARS mold. The release and optical properties of the ARS were measured to determine the lifetime of the release agent on the mold, and complete-filling UV-NIL was also executed for comparison. By means of partial-filling UV-NIL, we successfully fabricated ARS films with excellent performance up to 75th imprint compared to complete-filling UV-NIL up to the 40th imprint. 2015 Conference or Workshop Item PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/10471/1/Lifetime%20Prolongation%20of%20Release%20Agent%20on%20Antireflection%20Structure%20Molds%20by%20Means%20of%20Partialfilling%20Ultraviolet%20Nanoimprint%20Lithography.pdf Nurhafizah, Abu Talip and Hayashi, Tatsuya and Taniguchi, Jun and Hiwasa, Shin (2015) Lifetime Prolongation of Release Agent on Antireflection Structure Molds by Means of Partialfilling Ultraviolet Nanoimprint Lithography. In: ICEP-IAAC 2015 Proceedings : International Conference on Electronics Packaging and iMAPS All Asia Conference , 14-17 April 2015 , Kyoto, Japan. pp. 418-421.. http://dx.doi.org/10.1109/ICEP-IAAC.2015.7111048 |
| spellingShingle | TK Electrical engineering. Electronics Nuclear engineering Nurhafizah, Abu Talip Hayashi, Tatsuya Taniguchi, Jun Hiwasa, Shin Lifetime Prolongation of Release Agent on Antireflection Structure Molds by Means of Partialfilling Ultraviolet Nanoimprint Lithography |
| title | Lifetime Prolongation of Release Agent on Antireflection Structure Molds by Means of Partialfilling Ultraviolet Nanoimprint Lithography |
| title_full | Lifetime Prolongation of Release Agent on Antireflection Structure Molds by Means of Partialfilling Ultraviolet Nanoimprint Lithography |
| title_fullStr | Lifetime Prolongation of Release Agent on Antireflection Structure Molds by Means of Partialfilling Ultraviolet Nanoimprint Lithography |
| title_full_unstemmed | Lifetime Prolongation of Release Agent on Antireflection Structure Molds by Means of Partialfilling Ultraviolet Nanoimprint Lithography |
| title_short | Lifetime Prolongation of Release Agent on Antireflection Structure Molds by Means of Partialfilling Ultraviolet Nanoimprint Lithography |
| title_sort | lifetime prolongation of release agent on antireflection structure molds by means of partialfilling ultraviolet nanoimprint lithography |
| topic | TK Electrical engineering. Electronics Nuclear engineering |
| url | http://umpir.ump.edu.my/id/eprint/10471/1/Lifetime%20Prolongation%20of%20Release%20Agent%20on%20Antireflection%20Structure%20Molds%20by%20Means%20of%20Partialfilling%20Ultraviolet%20Nanoimprint%20Lithography.pdf |
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