A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability
The increasing environmental concern over the toxicity of lead (Pb) combined with strict regulations, the use of lead-based solders providing an inevitable driving force for the development of lead-free solder alloys. Many studies have been conducted for evaluation of the solder joint reliability wi...
Main Authors: | Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris |
---|---|
Format: | Book Chapter |
Language: | English English |
Published: |
WIT Press
2017
|
Subjects: | |
Online Access: | http://umpir.ump.edu.my/id/eprint/10492/1/24.%20A%20review%20on%20the%20effect%20of%20surface%20finish%20and%20cooling%20rate%20on%20solder%20joint%20reliability.pdf http://umpir.ump.edu.my/id/eprint/10492/7/24.%20A%20review%20on%20the%20effect%20of%20surface%20finish%20and%20cooling%20rate%20on%20solder%20joint%20reliability.pdf |
Similar Items
-
Microstructure Evolution at the Solder Joint During Isothermal Aging
by: Zetty Akhtar, Abd Malek, et al.
Published: (2014) -
Effect of Immersion Coating Deposition Time on Solder Joint Properties
by: Zetty Akhtar, Abd Malek, et al.
Published: (2016) -
Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
by: Zetty Akhtar, Abd Malek, et al.
Published: (2014) -
Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish
by: Hardinnawirda, Kahar, et al.
Published: (2016) -
Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating
by: Hardinnawirda, Kahar, et al.
Published: (2015)