Effect of Reflow Soldering Profile on Intermetallic Compound Formation
Reflow soldering in a nitrogen atmosphere is a common process in surface mount technology assembly since it can increase solder joint reliability. The present study investigated the effect of different reflow soldering atmospheres, either air or nitrogen, on intermetallic compound (IMC) formation a...
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| Format: | Article |
| Language: | English English |
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Inderscience
2015
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| Online Access: | http://umpir.ump.edu.my/id/eprint/11731/1/IJCAT%2052%284%29%20Paper%206_2015.pdf http://umpir.ump.edu.my/id/eprint/11731/7/Effect%20of%20reflow%20soldering%20profile%20on%20intermetallic%20compound%20formation.pdf |
| _version_ | 1825822683257896960 |
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| author | Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman |
| author_facet | Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman |
| author_sort | Siti Rabiatull Aisha, Idris |
| collection | UMP |
| description | Reflow soldering in a nitrogen atmosphere is a common process in surface mount technology assembly since it can increase solder joint reliability. The present study investigated the effect of different reflow soldering atmospheres, either air or nitrogen, on intermetallic
compound (IMC) formation and growth. Several techniques of materials characterisation including optical, image analysis, scanning electron microscopy and energy dispersive X-ray analysis were used to characterise the intermetallics. Besides, the effects of cooling rate and
isothermal ageing were also studied. In summary, reflowing under nitrogen atmosphere had better effect on IMC formation and growth compared to reflowing under air. Besides, the cooling rate of solder during reflow also appears to have an effect on the final structure of the solder joint, and controlling the growth behaviour of the IMC during subsequent isothermal ageing. However, further research can be carried out to determine the solder joint’s strength produced by both reflow soldering profiles. |
| first_indexed | 2024-03-06T12:00:16Z |
| format | Article |
| id | UMPir11731 |
| institution | Universiti Malaysia Pahang |
| language | English English |
| last_indexed | 2024-03-06T12:00:16Z |
| publishDate | 2015 |
| publisher | Inderscience |
| record_format | dspace |
| spelling | UMPir117312018-01-15T07:45:26Z http://umpir.ump.edu.my/id/eprint/11731/ Effect of Reflow Soldering Profile on Intermetallic Compound Formation Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman TA Engineering (General). Civil engineering (General) Reflow soldering in a nitrogen atmosphere is a common process in surface mount technology assembly since it can increase solder joint reliability. The present study investigated the effect of different reflow soldering atmospheres, either air or nitrogen, on intermetallic compound (IMC) formation and growth. Several techniques of materials characterisation including optical, image analysis, scanning electron microscopy and energy dispersive X-ray analysis were used to characterise the intermetallics. Besides, the effects of cooling rate and isothermal ageing were also studied. In summary, reflowing under nitrogen atmosphere had better effect on IMC formation and growth compared to reflowing under air. Besides, the cooling rate of solder during reflow also appears to have an effect on the final structure of the solder joint, and controlling the growth behaviour of the IMC during subsequent isothermal ageing. However, further research can be carried out to determine the solder joint’s strength produced by both reflow soldering profiles. Inderscience 2015 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/11731/1/IJCAT%2052%284%29%20Paper%206_2015.pdf application/pdf en http://umpir.ump.edu.my/id/eprint/11731/7/Effect%20of%20reflow%20soldering%20profile%20on%20intermetallic%20compound%20formation.pdf Siti Rabiatull Aisha, Idris and Ourdjini, Ali and Azmah Hanim, Mohamad Ariff and Saliza Azlina, Osman (2015) Effect of Reflow Soldering Profile on Intermetallic Compound Formation. International Journal of Computer Applications in Technology, 52 (4). pp. 244-250. ISSN 0952-8091 (print); 1741-5047 (online). (Published) http://dx.doi.org/10.1504/IJCAT.2015.073590 DOI: 10.1504/IJCAT.2015.073590 |
| spellingShingle | TA Engineering (General). Civil engineering (General) Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman Effect of Reflow Soldering Profile on Intermetallic Compound Formation |
| title | Effect of Reflow Soldering Profile on Intermetallic
Compound Formation |
| title_full | Effect of Reflow Soldering Profile on Intermetallic
Compound Formation |
| title_fullStr | Effect of Reflow Soldering Profile on Intermetallic
Compound Formation |
| title_full_unstemmed | Effect of Reflow Soldering Profile on Intermetallic
Compound Formation |
| title_short | Effect of Reflow Soldering Profile on Intermetallic
Compound Formation |
| title_sort | effect of reflow soldering profile on intermetallic compound formation |
| topic | TA Engineering (General). Civil engineering (General) |
| url | http://umpir.ump.edu.my/id/eprint/11731/1/IJCAT%2052%284%29%20Paper%206_2015.pdf http://umpir.ump.edu.my/id/eprint/11731/7/Effect%20of%20reflow%20soldering%20profile%20on%20intermetallic%20compound%20formation.pdf |
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