Intermetallic Growth and Shear Strength of SAC305/EN-Boron
The paper aimed to study the effect of aging and cooling rate on the reliability of the solder joint using electroless nickel boron (EN-Boron) as a surface finish in the electronic packaging area.EN-Boron was plated on Cu substrate through electroless plating method. This process was followed by ref...
| Những tác giả chính: | , , , |
|---|---|
| Định dạng: | Bài viết |
| Ngôn ngữ: | English English |
| Được phát hành: |
Emerald Group Publishing Limited
2016
|
| Những chủ đề: | |
| Truy cập trực tuyến: | http://umpir.ump.edu.my/id/eprint/13899/1/Intermetallic%20growth%20and%20shear%20strength%20of%20%20SAC305EN-Boron_wirda.pdf http://umpir.ump.edu.my/id/eprint/13899/7/fkm-2016-aisha-Intermetallic%20growth%20and%20shear%20strength1.pdf |