Finite Element Prediction of Heat-Affected Zone in Laser-micromachining of Silicon
Silicon has been a major material used for fabricating MEMS devices that are now potentially a far more pervasive technology. In processing of silicon material, laser-micromachining has been increasingly employed. However, laser debris and thermal crack are problematic with laser machining and also...
| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2008
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/1475/1/Finite_Element_Prediction_of_Heat-Affected_Zone_in_Laser-micromachining_of.pdf |