Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish

Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish

Electroless Nickel Boron had been appointed as potential coating in several applications in industry like aeronatics, petrochemical industry, electronics and firearms due to its desirable physical and mechanical properties such as high wear resistance and high hardness including provides uniformity...

पूर्ण विवरण

ग्रंथसूची विवरण
मुख्य लेखकों:	Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris, M., Ishak
स्वरूप:	लेख
भाषा:	English
प्रकाशित:	Trans Tech Publications, Switzerland 2016
विषय:	TJ Mechanical engineering and machinery
ऑनलाइन पहुंच:	http://umpir.ump.edu.my/id/eprint/15950/1/Deposition%20of%20Electroless%20Nickel%20Boron%20as%20Printed%20Circuit%20Board%20Surface%20Finish-fkm-2016-1.pdf

समान संसाधन

Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating
द्वारा: Hardinnawirda, Kahar, और अन्य
प्रकाशित: (2015)

Effect of electroless nickel-boron (EN-B) surface finish on solderability of SAC305 and solder joint strength
द्वारा: Hardinnawirda, Kahar
प्रकाशित: (2017)

A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability
द्वारा: Hardinnawirda, Kahar, और अन्य
प्रकाशित: (2017)

Intermetallic Growth and Shear Strength of SAC305/EN-Boron
द्वारा: Hardinnawirda, Kahar, और अन्य
प्रकाशित: (2016)

Influence of Second Reflow on the Intermetallic Compound Growth with Different Surface Finish
द्वारा: Hardinnawirda, Kahar, और अन्य
प्रकाशित: (2016)

A Review on Effect of Nickel Doping on Solder Joint Reliability
द्वारा: Siti Rabiatull Aisha, Idris, और अन्य
प्रकाशित: (2015)

Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
द्वारा: Zetty Akhtar, Abd Malek, और अन्य
प्रकाशित: (2014)

Effect of Immersion Coating Deposition Time on Solder Joint Properties
द्वारा: Zetty Akhtar, Abd Malek, और अन्य
प्रकाशित: (2016)

Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method
द्वारा: Siti Rabiatull Aisha, Idris, और अन्य
प्रकाशित: (2015)

Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
द्वारा: Idris, Siti Rabiatull Aisha
प्रकाशित: (2008)

Crystallization of electroless nickel-phosphorus and electroless nickel-boron plating on copper /
द्वारा: Tay, Cindy Tien Sze, 1986-, और अन्य
प्रकाशित: (2010)

Microstructure Evolution at the Solder Joint During Isothermal Aging
द्वारा: Zetty Akhtar, Abd Malek, और अन्य
प्रकाशित: (2014)

Crystallization of electroless nickel-phosphorus and electroless nickel-boron plating on copper [electronic resource] /
द्वारा: Tay, Cindy Tien Sze, 1986-
प्रकाशित: (2010)

Interfacial reactions during soldering of Sn - Ag - Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes /
द्वारा: Siti Rabiatull Aisha Idris, 1983-, और अन्य
प्रकाशित: (2008)

Interfacial reactions during soldering of Sn - Ag - Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes [electronic resource] /
द्वारा: Siti Rabiatull Aisha Idris, 1983-, और अन्य
प्रकाशित: (2008)

Evaluation of an integrated process of printing and electroless plating for electronic circuit board fabrication
द्वारा: Lim, Patricia Li Ying.
प्रकाशित: (2010)

Effect of Rice Husks as Filler in Polymer Matrix Composites
द्वारा: Siti Rabiatull Aisha, Idris, और अन्य
प्रकाशित: (2012)

Preparation of electroless nickel deposition on electrolytic manganese dioxide /
द्वारा: Suhaila Mohd. Sanip, और अन्य
प्रकाशित: (2003)

The effect of aging on the consumption of nickel layer in the electroless nickel/immersion gold (ENIG) surface finish /
द्वारा: 296700 Lee, Chee Hian
प्रकाशित: (2005)

Intermetallics formed between Sn-Ag-Cu solders and electroless nickel/ electroless palladium/ immersion gold surface finish /
द्वारा: Lock, Poh Choo, 1987-, और अन्य
प्रकाशित: (2010)

Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes /
द्वारा: 576681 Nor Akmal Fadil, और अन्य
प्रकाशित: (2007)

Intermetallic compound in lead free solder on electroless nickel/immersion gold surface finish /
द्वारा: 458141 Mah, Chia Wen
प्रकाशित: (2003)

Effect of Flux onto Intermetallic Compound Formation and Growth
द्वारा: Siti Rabiatull Aisha, Idris, और अन्य
प्रकाशित: (2016)

The effect of aging on the consumption of nickel layer in the electroless nickel/immersion gold (ENIG) surface finish [compact disc] /
द्वारा: 296700 Lee, Chee Hian
प्रकाशित: (2005)

Electroless nickel plating on copper alloy /
द्वारा: Mohd. Nasrul Muhammad, 1988-, और अन्य
प्रकाशित: (2012)

Intermetallics formed between Sn-Ag-Cu solders and electroless nickel/ electroless palladium/ immersion gold surface finish [electronic resource] /
द्वारा: Lock, Poh Choo, 1987-
प्रकाशित: (2010)

Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes [electronic resource] /
द्वारा: 576681 Nor Akmal Fadil
प्रकाशित: (2007)

Experimental and simulation study on lead-free solders and electroless nickel immersion silver surface finish
द्वारा: Hashim, Muhammad Syafiq
प्रकाशित: (2023)

Interfacial reactions between lead-free solders and electroless nickel/immersion gold surface finish /
द्वारा: Mohd. Muzamir Mahat, 1986-, और अन्य
प्रकाशित: (2009)

Effect of solder bump size on intermetallic compound formation between solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish /
द्वारा: 380319 Ching, Sze Pei
प्रकाशित: (2006)

Electroless plating as surface finishing in electronic packaging
द्वारा: Mohamed Ariff, Azmah Hanim
प्रकाशित: (2017)

Electroless deposition of macroporous hollow nickel fibre by assistance of surfactant soft templating
द्वारा: Lim, Jasper Jun Xian
प्रकाशित: (2021)

Interfacial reactions between lead - free solders and electroless nickel/immersion gold (ENIG) surface finish /
द्वारा: Boo, Nan Shing, 1981-, और अन्य
प्रकाशित: (2010)

Effect of solder bump size on intermetallic compound formation between solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish [microfilm] /
द्वारा: Fakulti Kejuruteraan Mekanikal
प्रकाशित: (2006)

Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold /
द्वारा: Ng, Mei Wah, 1986-, और अन्य
प्रकाशित: (2010)

Vibration study on printed circuit board (PCB) /
द्वारा: 488317 Mohd. Ikbal Hassan, और अन्य
प्रकाशित: (2008)

Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow
द्वारा: Siti Rabiatull Aisha, Idris, और अन्य
प्रकाशित: (2016)

Electroless nickel plating on plastics (ABS) /
द्वारा: Muhammad Zaky Yahya, 1986-, और अन्य
प्रकाशित: (2009)

Fine pitch electroless nickel plating
द्वारा: Zee, Bernice Mei Lin
प्रकाशित: (2009)

Electroless nickel plating on copper alloy [electronic resource] /
द्वारा: Mohd. Nasrul Muhammad, 1988-, और अन्य
प्रकाशित: (2012)