Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish

Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish

Electroless Nickel Boron had been appointed as potential coating in several applications in industry like aeronatics, petrochemical industry, electronics and firearms due to its desirable physical and mechanical properties such as high wear resistance and high hardness including provides uniformity...

Bibliografski detalji
Glavni autori:	Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris, M., Ishak
Format:	Članak
Jezik:	English
Izdano:	Trans Tech Publications, Switzerland 2016
Teme:	TJ Mechanical engineering and machinery
Online pristup:	http://umpir.ump.edu.my/id/eprint/15950/1/Deposition%20of%20Electroless%20Nickel%20Boron%20as%20Printed%20Circuit%20Board%20Surface%20Finish-fkm-2016-1.pdf

Slični predmeti

Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating
od: Hardinnawirda, Kahar, i dr.
Izdano: (2015)

Effect of electroless nickel-boron (EN-B) surface finish on solderability of SAC305 and solder joint strength
od: Hardinnawirda, Kahar
Izdano: (2017)

A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability
od: Hardinnawirda, Kahar, i dr.
Izdano: (2017)

Intermetallic Growth and Shear Strength of SAC305/EN-Boron
od: Hardinnawirda, Kahar, i dr.
Izdano: (2016)

Influence of Second Reflow on the Intermetallic Compound Growth with Different Surface Finish
od: Hardinnawirda, Kahar, i dr.
Izdano: (2016)

A Review on Effect of Nickel Doping on Solder Joint Reliability
od: Siti Rabiatull Aisha, Idris, i dr.
Izdano: (2015)

Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
od: Zetty Akhtar, Abd Malek, i dr.
Izdano: (2014)

Effect of Immersion Coating Deposition Time on Solder Joint Properties
od: Zetty Akhtar, Abd Malek, i dr.
Izdano: (2016)

Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method
od: Siti Rabiatull Aisha, Idris, i dr.
Izdano: (2015)

Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
od: Idris, Siti Rabiatull Aisha
Izdano: (2008)

Crystallization of electroless nickel-phosphorus and electroless nickel-boron plating on copper /
od: Tay, Cindy Tien Sze, 1986-, i dr.
Izdano: (2010)

Microstructure Evolution at the Solder Joint During Isothermal Aging
od: Zetty Akhtar, Abd Malek, i dr.
Izdano: (2014)

Crystallization of electroless nickel-phosphorus and electroless nickel-boron plating on copper [electronic resource] /
od: Tay, Cindy Tien Sze, 1986-
Izdano: (2010)

Interfacial reactions during soldering of Sn - Ag - Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes /
od: Siti Rabiatull Aisha Idris, 1983-, i dr.
Izdano: (2008)

Interfacial reactions during soldering of Sn - Ag - Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes [electronic resource] /
od: Siti Rabiatull Aisha Idris, 1983-, i dr.
Izdano: (2008)

Evaluation of an integrated process of printing and electroless plating for electronic circuit board fabrication
od: Lim, Patricia Li Ying.
Izdano: (2010)

Effect of Rice Husks as Filler in Polymer Matrix Composites
od: Siti Rabiatull Aisha, Idris, i dr.
Izdano: (2012)

Preparation of electroless nickel deposition on electrolytic manganese dioxide /
od: Suhaila Mohd. Sanip, i dr.
Izdano: (2003)

The effect of aging on the consumption of nickel layer in the electroless nickel/immersion gold (ENIG) surface finish /
od: 296700 Lee, Chee Hian
Izdano: (2005)

Intermetallics formed between Sn-Ag-Cu solders and electroless nickel/ electroless palladium/ immersion gold surface finish /
od: Lock, Poh Choo, 1987-, i dr.
Izdano: (2010)

Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes /
od: 576681 Nor Akmal Fadil, i dr.
Izdano: (2007)

Intermetallic compound in lead free solder on electroless nickel/immersion gold surface finish /
od: 458141 Mah, Chia Wen
Izdano: (2003)

Effect of Flux onto Intermetallic Compound Formation and Growth
od: Siti Rabiatull Aisha, Idris, i dr.
Izdano: (2016)

The effect of aging on the consumption of nickel layer in the electroless nickel/immersion gold (ENIG) surface finish [compact disc] /
od: 296700 Lee, Chee Hian
Izdano: (2005)

Electroless nickel plating on copper alloy /
od: Mohd. Nasrul Muhammad, 1988-, i dr.
Izdano: (2012)

Intermetallics formed between Sn-Ag-Cu solders and electroless nickel/ electroless palladium/ immersion gold surface finish [electronic resource] /
od: Lock, Poh Choo, 1987-
Izdano: (2010)

Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes [electronic resource] /
od: 576681 Nor Akmal Fadil
Izdano: (2007)

Experimental and simulation study on lead-free solders and electroless nickel immersion silver surface finish
od: Hashim, Muhammad Syafiq
Izdano: (2023)

Interfacial reactions between lead-free solders and electroless nickel/immersion gold surface finish /
od: Mohd. Muzamir Mahat, 1986-, i dr.
Izdano: (2009)

Effect of solder bump size on intermetallic compound formation between solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish /
od: 380319 Ching, Sze Pei
Izdano: (2006)

Electroless plating as surface finishing in electronic packaging
od: Mohamed Ariff, Azmah Hanim
Izdano: (2017)

Electroless deposition of macroporous hollow nickel fibre by assistance of surfactant soft templating
od: Lim, Jasper Jun Xian
Izdano: (2021)

Interfacial reactions between lead - free solders and electroless nickel/immersion gold (ENIG) surface finish /
od: Boo, Nan Shing, 1981-, i dr.
Izdano: (2010)

Effect of solder bump size on intermetallic compound formation between solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish [microfilm] /
od: Fakulti Kejuruteraan Mekanikal
Izdano: (2006)

Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold /
od: Ng, Mei Wah, 1986-, i dr.
Izdano: (2010)

Vibration study on printed circuit board (PCB) /
od: 488317 Mohd. Ikbal Hassan, i dr.
Izdano: (2008)

Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow
od: Siti Rabiatull Aisha, Idris, i dr.
Izdano: (2016)

Electroless nickel plating on plastics (ABS) /
od: Muhammad Zaky Yahya, 1986-, i dr.
Izdano: (2009)

Fine pitch electroless nickel plating
od: Zee, Bernice Mei Lin
Izdano: (2009)

Electroless nickel plating on copper alloy [electronic resource] /
od: Mohd. Nasrul Muhammad, 1988-, i dr.
Izdano: (2012)