Effects of Sintering Temperatures on Microstructures and Mechanical Properties of Sn4.0Ag0.5Cu1.0Ni Solder Alloy
This research was carried out to investigate the effects of sintering temperature on the properties of Sn-4.0Ag-0.5Cu-1.0Ni solder alloy by varying the temperatures. The Sn-4.0Ag-0.5Cu-1.0Ni solder alloy was prepared by using powder metallurgy method by press and sinter routes. 99.9% of pure Sn, Ag,...
Glavni autori: | Siti Rabiatull Aisha, Idris, Nadhrah, Murad, M., Ishak |
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Format: | Conference or Workshop Item |
Jezik: | English English |
Izdano: |
IEEE
2016
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Teme: | |
Online pristup: | http://umpir.ump.edu.my/id/eprint/16233/1/PAPER%20%2376%20IEMT%202016_NADHRAH%20MURAD.pdf http://umpir.ump.edu.my/id/eprint/16233/7/effects%20of%20sintering1.pdf |
Slični predmeti
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Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy
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Microstructural evaluation of sn3.0ag0.5cu solder alloy fabricated via powder metallurgy method
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Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints
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Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
od: Siti Rabiatull Aisha, Idris, i dr.
Izdano: (2012) -
Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
od: Siti Rabiatull Aisha, Idris, i dr.
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