A Review on Effect of Nickel Doping on Solder Joint Reliability
Currently, the demands for portable electronic gadgets such as Personal Digital Assistant, tablets and smart phone have increased due to its light weight and multifunctionality. But the major drawbacks of these portable devices are prone to accidental drops and may cause internal circuit board dama...
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2015
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| Online Access: | http://umpir.ump.edu.my/id/eprint/16238/1/fkm-2015-zetty-Review%20on%20Effect%20of%20Nickel%20Doping%20on%20Solder%20Joint%20Reliability.pdf |
| _version_ | 1796991880726052864 |
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| author | Siti Rabiatull Aisha, Idris Zetty Akhtar, Abd Malek Hardinnawirda, Kahar |
| author_facet | Siti Rabiatull Aisha, Idris Zetty Akhtar, Abd Malek Hardinnawirda, Kahar |
| author_sort | Siti Rabiatull Aisha, Idris |
| collection | UMP |
| description | Currently, the demands for portable electronic gadgets such as Personal Digital Assistant, tablets and smart phone have increased due to its light weight and multifunctionality. But the major drawbacks of these portable devices are prone to accidental drops and may cause internal circuit board
damage. When an electronic product drops on the ground, the impact force and deformation which is transferred internally to the print circuit board (PCB) can cause brittle fracture at the solder joint interface or by impact
±8.tigue in the solder materials. Thus, in order to further enhance the mechanical properties of the solder joints, doping an element such as such as rare earth, Bi, Sb, Fe, Co, Cr, :Mn, Ti, In, Ni, and Ge as alloying addition has
been selected in previous researchers as one of those solutions. This paper summarizes the effect of Ni doping element on intermetallic compound (IMC) formation, interfacial reaction and solders joint reliability. These
reviews should provide an important basis of understanding the development of lead-free solders with addition of alloying elements. |
| first_indexed | 2024-03-06T12:11:53Z |
| format | Conference or Workshop Item |
| id | UMPir16238 |
| institution | Universiti Malaysia Pahang |
| language | English |
| last_indexed | 2024-03-06T12:11:53Z |
| publishDate | 2015 |
| record_format | dspace |
| spelling | UMPir162382018-01-15T07:38:18Z http://umpir.ump.edu.my/id/eprint/16238/ A Review on Effect of Nickel Doping on Solder Joint Reliability Siti Rabiatull Aisha, Idris Zetty Akhtar, Abd Malek Hardinnawirda, Kahar Q Science (General) Currently, the demands for portable electronic gadgets such as Personal Digital Assistant, tablets and smart phone have increased due to its light weight and multifunctionality. But the major drawbacks of these portable devices are prone to accidental drops and may cause internal circuit board damage. When an electronic product drops on the ground, the impact force and deformation which is transferred internally to the print circuit board (PCB) can cause brittle fracture at the solder joint interface or by impact ±8.tigue in the solder materials. Thus, in order to further enhance the mechanical properties of the solder joints, doping an element such as such as rare earth, Bi, Sb, Fe, Co, Cr, :Mn, Ti, In, Ni, and Ge as alloying addition has been selected in previous researchers as one of those solutions. This paper summarizes the effect of Ni doping element on intermetallic compound (IMC) formation, interfacial reaction and solders joint reliability. These reviews should provide an important basis of understanding the development of lead-free solders with addition of alloying elements. 2015-01 Conference or Workshop Item NonPeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/16238/1/fkm-2015-zetty-Review%20on%20Effect%20of%20Nickel%20Doping%20on%20Solder%20Joint%20Reliability.pdf Siti Rabiatull Aisha, Idris and Zetty Akhtar, Abd Malek and Hardinnawirda, Kahar (2015) A Review on Effect of Nickel Doping on Solder Joint Reliability. In: National Conference for Postgraduate Research (NCON-PGR 2015) , 24-25 January 2015 , Universiti Malaysia Pahang (UMP). pp. 1-16.. |
| spellingShingle | Q Science (General) Siti Rabiatull Aisha, Idris Zetty Akhtar, Abd Malek Hardinnawirda, Kahar A Review on Effect of Nickel Doping on Solder Joint Reliability |
| title | A Review on Effect of Nickel Doping on Solder Joint Reliability |
| title_full | A Review on Effect of Nickel Doping on Solder Joint Reliability |
| title_fullStr | A Review on Effect of Nickel Doping on Solder Joint Reliability |
| title_full_unstemmed | A Review on Effect of Nickel Doping on Solder Joint Reliability |
| title_short | A Review on Effect of Nickel Doping on Solder Joint Reliability |
| title_sort | review on effect of nickel doping on solder joint reliability |
| topic | Q Science (General) |
| url | http://umpir.ump.edu.my/id/eprint/16238/1/fkm-2015-zetty-Review%20on%20Effect%20of%20Nickel%20Doping%20on%20Solder%20Joint%20Reliability.pdf |
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