Potential of direct evaporative cooling system under metal plate attachment to wetted pad application

Direct evaporative cooling (DEC) system, even in the simpler configuration, is concerned with the wet pad design for improving system cooling performance. The performance measure is assessed by the evaporation of the pad liquid content and changes of mainstream flow properties. This article examined...

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Main Authors: Mohd Syahray Izham, Muhazihat, Nurrina, Rosli, Radhiyah, Abd Aziz, Abdul Aziz, Jaafar
Format: Article
Language:English
Published: Universiti Malaysia Pahang 2018
Subjects:
Online Access:http://umpir.ump.edu.my/id/eprint/22137/1/JMMST%201st%20issue%20-%20Potential%20of%20direct%20evaporative%20cooling%20system%20under%20metal%20plate%20attachment%20to%20wetted%20pad%20application.pdf
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author Mohd Syahray Izham, Muhazihat
Nurrina, Rosli
Radhiyah, Abd Aziz
Abdul Aziz, Jaafar
author_facet Mohd Syahray Izham, Muhazihat
Nurrina, Rosli
Radhiyah, Abd Aziz
Abdul Aziz, Jaafar
author_sort Mohd Syahray Izham, Muhazihat
collection UMP
description Direct evaporative cooling (DEC) system, even in the simpler configuration, is concerned with the wet pad design for improving system cooling performance. The performance measure is assessed by the evaporation of the pad liquid content and changes of mainstream flow properties. This article examined a potential DEC design in laboratory scale that incorporates a water-based wet pad with metal plate attachment. The proposed system is modelled by a low speed uniform air flowing over a heated wet pad. The influence of metal thermal conductivity and the surface contact on air temperature and humidity was evaluated. The results shows that efficiency increases nearly 50 % despite poor influence of metal property and contact area on mainflow properties. Increasing contact area of metal plate plays a major role to preserve the cooling efficiency. Since, base pad without metal plate shows superior performance than that of with metal plate due to the loss sensible heat, DEC system must be designed with consideration of providing more homogenous air mixture and preventing the loss sensible heat.
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spelling UMPir221372018-11-12T01:47:45Z http://umpir.ump.edu.my/id/eprint/22137/ Potential of direct evaporative cooling system under metal plate attachment to wetted pad application Mohd Syahray Izham, Muhazihat Nurrina, Rosli Radhiyah, Abd Aziz Abdul Aziz, Jaafar TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TS Manufactures Direct evaporative cooling (DEC) system, even in the simpler configuration, is concerned with the wet pad design for improving system cooling performance. The performance measure is assessed by the evaporation of the pad liquid content and changes of mainstream flow properties. This article examined a potential DEC design in laboratory scale that incorporates a water-based wet pad with metal plate attachment. The proposed system is modelled by a low speed uniform air flowing over a heated wet pad. The influence of metal thermal conductivity and the surface contact on air temperature and humidity was evaluated. The results shows that efficiency increases nearly 50 % despite poor influence of metal property and contact area on mainflow properties. Increasing contact area of metal plate plays a major role to preserve the cooling efficiency. Since, base pad without metal plate shows superior performance than that of with metal plate due to the loss sensible heat, DEC system must be designed with consideration of providing more homogenous air mixture and preventing the loss sensible heat. Universiti Malaysia Pahang 2018-09-13 Article PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/22137/1/JMMST%201st%20issue%20-%20Potential%20of%20direct%20evaporative%20cooling%20system%20under%20metal%20plate%20attachment%20to%20wetted%20pad%20application.pdf Mohd Syahray Izham, Muhazihat and Nurrina, Rosli and Radhiyah, Abd Aziz and Abdul Aziz, Jaafar (2018) Potential of direct evaporative cooling system under metal plate attachment to wetted pad application. Journal of Modern Manufacturing Systems and Technology, 1. pp. 69-75. ISSN 2636-9575. (Published) http://journal.ump.edu.my/jmmst/article/view/200 DOI: https://doi.org/10.15282/jmmst.v1i1.200
spellingShingle TA Engineering (General). Civil engineering (General)
TJ Mechanical engineering and machinery
TS Manufactures
Mohd Syahray Izham, Muhazihat
Nurrina, Rosli
Radhiyah, Abd Aziz
Abdul Aziz, Jaafar
Potential of direct evaporative cooling system under metal plate attachment to wetted pad application
title Potential of direct evaporative cooling system under metal plate attachment to wetted pad application
title_full Potential of direct evaporative cooling system under metal plate attachment to wetted pad application
title_fullStr Potential of direct evaporative cooling system under metal plate attachment to wetted pad application
title_full_unstemmed Potential of direct evaporative cooling system under metal plate attachment to wetted pad application
title_short Potential of direct evaporative cooling system under metal plate attachment to wetted pad application
title_sort potential of direct evaporative cooling system under metal plate attachment to wetted pad application
topic TA Engineering (General). Civil engineering (General)
TJ Mechanical engineering and machinery
TS Manufactures
url http://umpir.ump.edu.my/id/eprint/22137/1/JMMST%201st%20issue%20-%20Potential%20of%20direct%20evaporative%20cooling%20system%20under%20metal%20plate%20attachment%20to%20wetted%20pad%20application.pdf
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