A review on mechanical properties of SnAgCu/Cu joint using laser soldering
This paper focuses on publishing the review of mechanical properties at the interface between SnAgCu (SAC) solder and Copper substrate after laser soldering. This involved on basic principles of solder alloy and Copper diffusion mechanism. In addition, this paper also reviews laser solder effects to...
| Main Authors: | , , |
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| Format: | Book Chapter |
| Language: | English English |
| Published: |
Springer, Singapore
2018
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/24641/1/2.%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf http://umpir.ump.edu.my/id/eprint/24641/2/2.1%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf |
| _version_ | 1825812646255919104 |
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| author | Nabila, Tamar Jaya Siti Rabiatull Aisha, Idris M., Ishak |
| author_facet | Nabila, Tamar Jaya Siti Rabiatull Aisha, Idris M., Ishak |
| author_sort | Nabila, Tamar Jaya |
| collection | UMP |
| description | This paper focuses on publishing the review of mechanical properties at the interface between SnAgCu (SAC) solder and Copper substrate after laser soldering. This involved on basic principles of solder alloy and Copper diffusion mechanism. In addition, this paper also reviews laser solder effects towards mechanical properties of the solder joint. This paper approach on the review of the solder joint strength which regards to intermetallic compound type and thickness. The output of this paper is to create an understanding for the readers about variance of laser soldering parameters and its effect on the mechanical properties of the solder joint by including discussion from other research paper findings. |
| first_indexed | 2024-03-06T12:32:14Z |
| format | Book Chapter |
| id | UMPir24641 |
| institution | Universiti Malaysia Pahang |
| language | English English |
| last_indexed | 2024-03-06T12:32:14Z |
| publishDate | 2018 |
| publisher | Springer, Singapore |
| record_format | dspace |
| spelling | UMPir246412019-04-15T06:22:01Z http://umpir.ump.edu.my/id/eprint/24641/ A review on mechanical properties of SnAgCu/Cu joint using laser soldering Nabila, Tamar Jaya Siti Rabiatull Aisha, Idris M., Ishak TJ Mechanical engineering and machinery This paper focuses on publishing the review of mechanical properties at the interface between SnAgCu (SAC) solder and Copper substrate after laser soldering. This involved on basic principles of solder alloy and Copper diffusion mechanism. In addition, this paper also reviews laser solder effects towards mechanical properties of the solder joint. This paper approach on the review of the solder joint strength which regards to intermetallic compound type and thickness. The output of this paper is to create an understanding for the readers about variance of laser soldering parameters and its effect on the mechanical properties of the solder joint by including discussion from other research paper findings. Springer, Singapore 2018 Book Chapter PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/24641/1/2.%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf pdf en http://umpir.ump.edu.my/id/eprint/24641/2/2.1%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf Nabila, Tamar Jaya and Siti Rabiatull Aisha, Idris and M., Ishak (2018) A review on mechanical properties of SnAgCu/Cu joint using laser soldering. In: The Advances in Joining Technology. Lecture Notes in Mechanical Engineering . Springer, Singapore, pp. 97-107. ISBN 9978-981-10-9040-0 https://doi.org/10.1007/978-981-10-9041-7_8 https://doi.org/10.1007/978-981-10-9041-7_8 |
| spellingShingle | TJ Mechanical engineering and machinery Nabila, Tamar Jaya Siti Rabiatull Aisha, Idris M., Ishak A review on mechanical properties of SnAgCu/Cu joint using laser soldering |
| title | A review on mechanical properties of SnAgCu/Cu joint using laser soldering |
| title_full | A review on mechanical properties of SnAgCu/Cu joint using laser soldering |
| title_fullStr | A review on mechanical properties of SnAgCu/Cu joint using laser soldering |
| title_full_unstemmed | A review on mechanical properties of SnAgCu/Cu joint using laser soldering |
| title_short | A review on mechanical properties of SnAgCu/Cu joint using laser soldering |
| title_sort | review on mechanical properties of snagcu cu joint using laser soldering |
| topic | TJ Mechanical engineering and machinery |
| url | http://umpir.ump.edu.my/id/eprint/24641/1/2.%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf http://umpir.ump.edu.my/id/eprint/24641/2/2.1%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf |
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