The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth
Recently, the laser soldering method has been introduced among electronic manufacturers because of its superior properties such as non-contact and localised heating, quick rise and drop in temperature, and ease of automation compared to reflow soldering. This paper discusses the effect of laser sold...
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| Format: | Book Chapter |
| Language: | English English |
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Springer
2022
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| Online Access: | http://umpir.ump.edu.my/id/eprint/33588/2/Book%20chapter_springer%20SRAI.pdf http://umpir.ump.edu.my/id/eprint/33588/8/The%20effect%20of%20laser%20soldering%20onto%20intermetallic.pdf |
| _version_ | 1825814236286156800 |
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| author | Siti Rabiatull Aisha, Idris Nabila, Tamar Jaya Muhammad Asyraf, Abdullah |
| author_facet | Siti Rabiatull Aisha, Idris Nabila, Tamar Jaya Muhammad Asyraf, Abdullah |
| author_sort | Siti Rabiatull Aisha, Idris |
| collection | UMP |
| description | Recently, the laser soldering method has been introduced among electronic manufacturers because of its superior properties such as non-contact and localised heating, quick rise and drop in temperature, and ease of automation compared to reflow soldering. This paper discusses the effect of laser soldering parameters on intermetallic compound formation and growth between lead-free solder alloy and copper substrate. The analysis was conducted for the type of laser used for heat-sensitive components and characteristics of the laser soldering process, which could promote or inhibit excessive growth of intermetallic compound formation. |
| first_indexed | 2024-03-06T12:55:48Z |
| format | Book Chapter |
| id | UMPir33588 |
| institution | Universiti Malaysia Pahang |
| language | English English |
| last_indexed | 2024-03-06T12:55:48Z |
| publishDate | 2022 |
| publisher | Springer |
| record_format | dspace |
| spelling | UMPir335882022-05-31T00:13:31Z http://umpir.ump.edu.my/id/eprint/33588/ The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth Siti Rabiatull Aisha, Idris Nabila, Tamar Jaya Muhammad Asyraf, Abdullah TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TN Mining engineering. Metallurgy Recently, the laser soldering method has been introduced among electronic manufacturers because of its superior properties such as non-contact and localised heating, quick rise and drop in temperature, and ease of automation compared to reflow soldering. This paper discusses the effect of laser soldering parameters on intermetallic compound formation and growth between lead-free solder alloy and copper substrate. The analysis was conducted for the type of laser used for heat-sensitive components and characteristics of the laser soldering process, which could promote or inhibit excessive growth of intermetallic compound formation. Springer 2022 Book Chapter PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/33588/2/Book%20chapter_springer%20SRAI.pdf pdf en http://umpir.ump.edu.my/id/eprint/33588/8/The%20effect%20of%20laser%20soldering%20onto%20intermetallic.pdf Siti Rabiatull Aisha, Idris and Nabila, Tamar Jaya and Muhammad Asyraf, Abdullah (2022) The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth. In: Recent Progress in Lead-Free Solder Technology. Springer, Switzerland AG, pp. 265-282. ISBN 978-3-030-93441-5 https://doi.org/10.1007/978-3-030-93441-5_12 https://doi.org/10.1007/978-3-030-93441-5_12 |
| spellingShingle | TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TN Mining engineering. Metallurgy Siti Rabiatull Aisha, Idris Nabila, Tamar Jaya Muhammad Asyraf, Abdullah The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth |
| title | The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth |
| title_full | The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth |
| title_fullStr | The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth |
| title_full_unstemmed | The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth |
| title_short | The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth |
| title_sort | effect of laser soldering onto intermetallic compound formation growth |
| topic | TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TN Mining engineering. Metallurgy |
| url | http://umpir.ump.edu.my/id/eprint/33588/2/Book%20chapter_springer%20SRAI.pdf http://umpir.ump.edu.my/id/eprint/33588/8/The%20effect%20of%20laser%20soldering%20onto%20intermetallic.pdf |
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