Khairul, M. A., Muhamad, M. N., Asrulnizam, A. M., Kawarada, H., Falina, S., & Mohd, S. (2022). A comparative modelling study of new robust packaging technology 1mm2 VCSEL packages and their mechanical stress properties. MDPI AG.
Chicago Style (17th ed.) CitationKhairul, Mohd Arshad, Mat Noor Muhamad, Abd Manaf Asrulnizam, Hiroshi Kawarada, Shaili Falina, and Syamsul Mohd. A Comparative Modelling Study of New Robust Packaging Technology 1mm2 VCSEL Packages and Their Mechanical Stress Properties. MDPI AG, 2022.
MLA (9th ed.) CitationKhairul, Mohd Arshad, et al. A Comparative Modelling Study of New Robust Packaging Technology 1mm2 VCSEL Packages and Their Mechanical Stress Properties. MDPI AG, 2022.
Warning: These citations may not always be 100% accurate.