Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering
The awareness of lead-free solders can be attributed to their environmental and human-health related benefits. Due to this consciousness, research toward lead-free solder alloy became a concern. Tin-copper (SnCu) solder alloy is one of the candidates that can meet the characteristic of tin–lead (SnP...
| Main Authors: | , |
|---|---|
| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
Springer Nature
2023
|
| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/37467/1/Effect%20of%20Sn-xCu%20Solder%20Alloy%20onto%20Intermetallic%20Formation%20After%20Laser%20Soldering1.pdf |
| _version_ | 1825814937277038592 |
|---|---|
| author | Muhammad Asyraf, Abdullah Siti Rabiatull Aisha, Idris |
| author_facet | Muhammad Asyraf, Abdullah Siti Rabiatull Aisha, Idris |
| author_sort | Muhammad Asyraf, Abdullah |
| collection | UMP |
| description | The awareness of lead-free solders can be attributed to their environmental and human-health related benefits. Due to this consciousness, research toward lead-free solder alloy became a concern. Tin-copper (SnCu) solder alloy is one of the candidates that can meet the characteristic of tin–lead (SnPb). The objective of this study is to analyse the wetting behaviour, intermetallic compound (IMC) thickness and also the spread ratio by varies the copper weight percentage (Cu wt%) in SnCu solder alloy. Solder alloy used was Sn-xCu, where x = 0.0, 0.3, 0.5, 0.7, 1.0 which was soldered onto electroless nickel immersion gold (ENIG) substrate using carbon dioxide (CO2) laser. Parameters used for laser soldering was 35 W for the laser power, focal length was kept constant, scanning time was 0.04 s, and scanning speed was 100 mm/s. Then these sample were subjected to isothermal aging with the duration of 0, 200, 500, 1000 and 2000 h. In the final analysis, the IMC thickness and wetting behaviour characteristics were characterized by metallographic microscopy. The results showed that the higher the Cu percentage in the solder alloy, the higher the thickness formed at the solder joint interface. Besides that, the morphology of IMCs additionally changed with aging time whereby it changed into much uniform and continuous shape, Nonetheless, its thickness was found to be increasing upon aging duration. Furthermore, the spread factor and spread ratio increase, but the equilibrium contact angle decreases with increasing Cu content. These results were the proof that Sn-0.7Cu/ENIG offers a good solder joint performance as compared to other copper percentage. |
| first_indexed | 2024-03-06T13:05:59Z |
| format | Conference or Workshop Item |
| id | UMPir37467 |
| institution | Universiti Malaysia Pahang |
| language | English |
| last_indexed | 2024-03-06T13:05:59Z |
| publishDate | 2023 |
| publisher | Springer Nature |
| record_format | dspace |
| spelling | UMPir374672023-04-12T07:55:54Z http://umpir.ump.edu.my/id/eprint/37467/ Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering Muhammad Asyraf, Abdullah Siti Rabiatull Aisha, Idris TJ Mechanical engineering and machinery TS Manufactures The awareness of lead-free solders can be attributed to their environmental and human-health related benefits. Due to this consciousness, research toward lead-free solder alloy became a concern. Tin-copper (SnCu) solder alloy is one of the candidates that can meet the characteristic of tin–lead (SnPb). The objective of this study is to analyse the wetting behaviour, intermetallic compound (IMC) thickness and also the spread ratio by varies the copper weight percentage (Cu wt%) in SnCu solder alloy. Solder alloy used was Sn-xCu, where x = 0.0, 0.3, 0.5, 0.7, 1.0 which was soldered onto electroless nickel immersion gold (ENIG) substrate using carbon dioxide (CO2) laser. Parameters used for laser soldering was 35 W for the laser power, focal length was kept constant, scanning time was 0.04 s, and scanning speed was 100 mm/s. Then these sample were subjected to isothermal aging with the duration of 0, 200, 500, 1000 and 2000 h. In the final analysis, the IMC thickness and wetting behaviour characteristics were characterized by metallographic microscopy. The results showed that the higher the Cu percentage in the solder alloy, the higher the thickness formed at the solder joint interface. Besides that, the morphology of IMCs additionally changed with aging time whereby it changed into much uniform and continuous shape, Nonetheless, its thickness was found to be increasing upon aging duration. Furthermore, the spread factor and spread ratio increase, but the equilibrium contact angle decreases with increasing Cu content. These results were the proof that Sn-0.7Cu/ENIG offers a good solder joint performance as compared to other copper percentage. Springer Nature 2023 Conference or Workshop Item PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/37467/1/Effect%20of%20Sn-xCu%20Solder%20Alloy%20onto%20Intermetallic%20Formation%20After%20Laser%20Soldering1.pdf Muhammad Asyraf, Abdullah and Siti Rabiatull Aisha, Idris (2023) Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering. In: Technological Advancement in Mechanical and Automotive Engineering: ICMER 2021 , 26-27 October 2021 , Virtual Conference, Universiti Malaysia Pahang. pp. 869-880.. ISBN 978-981-19-1457-7 (Published) https://doi.org/10.1007/978-981-19-1457-7_67 |
| spellingShingle | TJ Mechanical engineering and machinery TS Manufactures Muhammad Asyraf, Abdullah Siti Rabiatull Aisha, Idris Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering |
| title | Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering |
| title_full | Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering |
| title_fullStr | Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering |
| title_full_unstemmed | Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering |
| title_short | Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering |
| title_sort | effect of sn xcu solder alloy onto intermetallic formation after laser soldering |
| topic | TJ Mechanical engineering and machinery TS Manufactures |
| url | http://umpir.ump.edu.my/id/eprint/37467/1/Effect%20of%20Sn-xCu%20Solder%20Alloy%20onto%20Intermetallic%20Formation%20After%20Laser%20Soldering1.pdf |
| work_keys_str_mv | AT muhammadasyrafabdullah effectofsnxcusolderalloyontointermetallicformationafterlasersoldering AT sitirabiatullaishaidris effectofsnxcusolderalloyontointermetallicformationafterlasersoldering |