M. H., M. Z., & S. R. A., I. (2023). A simulation study on interfacial reaction between Sn3Ag0.5Cu and Sn0.7Cu using different substrates after reflow soldering. Springer.
Chicago Style (17th ed.) CitationM. H., Mohd Zaki, and Idris S. R. A. A Simulation Study on Interfacial Reaction Between Sn3Ag0.5Cu and Sn0.7Cu Using Different Substrates After Reflow Soldering. Springer, 2023.
MLA (9th ed.) CitationM. H., Mohd Zaki, and Idris S. R. A. A Simulation Study on Interfacial Reaction Between Sn3Ag0.5Cu and Sn0.7Cu Using Different Substrates After Reflow Soldering. Springer, 2023.
Warning: These citations may not always be 100% accurate.